LCT integration optimization on a printed circuit board technology platform

ECW de Jong; JA Ferreira; P Bauer

doi:doi:10.1109/IAS.2006.256788

LCT integration optimization on a printed circuit board technology platform

ECW de Jong, JA Ferreira, P Bauer

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

2 Citations (Scopus)

Abstract

Prominent integration efforts, implementing various technologies and focussing on electromagnetic integration in the first place, have already been attempted in the past, with promising results. From a manufacturing point of view combining different technologies is a costly and complex process which also decreases the system reliability. The use of a single technology for integration therefore holds obvious advantages. An approach to realise an integrated resonant circuit completely in PCB technology is investigated. It is shown that electromagnetic and technology platform integration does not always go together. In this case, for the sake of low cost and manufacturability, technology integration goes first.

Original language	Undefined/Unknown
Title of host publication	IAS 2006, Conference record of the 2006 IEEE industry applications conference
Editors	s.n.
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	1849-1856
Number of pages	8
ISBN (Print)	1-4244-0365-0
DOIs	https://doi.org/doi:10.1109/IAS.2006.256788
Publication status	Published - 2006
Event	Industry Applications Conference, 2006. 41st IAS Annual Meeting, Tampa - Piscataway Duration: 8 Oct 2006 → 12 Oct 2006

Publication series

Name
Publisher	IEEE

Name
Volume	4

Conference

Conference	Industry Applications Conference, 2006. 41st IAS Annual Meeting, Tampa
Period	8/10/06 → 12/10/06

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Access to Document

doi:10.1109/IAS.2006.256788

Cite this

@inproceedings{890bf8f5fe3b4d7f92acee49faecd0a0,

title = "LCT integration optimization on a printed circuit board technology platform",

abstract = "Prominent integration efforts, implementing various technologies and focussing on electromagnetic integration in the first place, have already been attempted in the past, with promising results. From a manufacturing point of view combining different technologies is a costly and complex process which also decreases the system reliability. The use of a single technology for integration therefore holds obvious advantages. An approach to realise an integrated resonant circuit completely in PCB technology is investigated. It is shown that electromagnetic and technology platform integration does not always go together. In this case, for the sake of low cost and manufacturability, technology integration goes first.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "{de Jong}, ECW and JA Ferreira and P Bauer",

year = "2006",

doi = "doi:10.1109/IAS.2006.256788",

language = "Undefined/Unknown",

isbn = "1-4244-0365-0",

publisher = "IEEE Society",

pages = "1849--1856",

editor = "s.n.",

booktitle = "IAS 2006, Conference record of the 2006 IEEE industry applications conference",

note = "Industry Applications Conference, 2006. 41st IAS Annual Meeting, Tampa ; Conference date: 08-10-2006 Through 12-10-2006",

}

de Jong, ECW, Ferreira, JA & Bauer, P 2006, LCT integration optimization on a printed circuit board technology platform. in s.n. (ed.), IAS 2006, Conference record of the 2006 IEEE industry applications conference. IEEE Society, Piscataway, pp. 1849-1856, Industry Applications Conference, 2006. 41st IAS Annual Meeting, Tampa, 8/10/06. https://doi.org/doi:10.1109/IAS.2006.256788

TY - GEN

T1 - LCT integration optimization on a printed circuit board technology platform

AU - de Jong, ECW

AU - Ferreira, JA

AU - Bauer, P

PY - 2006

Y1 - 2006

N2 - Prominent integration efforts, implementing various technologies and focussing on electromagnetic integration in the first place, have already been attempted in the past, with promising results. From a manufacturing point of view combining different technologies is a costly and complex process which also decreases the system reliability. The use of a single technology for integration therefore holds obvious advantages. An approach to realise an integrated resonant circuit completely in PCB technology is investigated. It is shown that electromagnetic and technology platform integration does not always go together. In this case, for the sake of low cost and manufacturability, technology integration goes first.

AB - Prominent integration efforts, implementing various technologies and focussing on electromagnetic integration in the first place, have already been attempted in the past, with promising results. From a manufacturing point of view combining different technologies is a costly and complex process which also decreases the system reliability. The use of a single technology for integration therefore holds obvious advantages. An approach to realise an integrated resonant circuit completely in PCB technology is investigated. It is shown that electromagnetic and technology platform integration does not always go together. In this case, for the sake of low cost and manufacturability, technology integration goes first.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

U2 - doi:10.1109/IAS.2006.256788

DO - doi:10.1109/IAS.2006.256788

M3 - Conference contribution

SN - 1-4244-0365-0

SP - 1849

EP - 1856

BT - IAS 2006, Conference record of the 2006 IEEE industry applications conference

A2 - s.n., null

PB - IEEE Society

CY - Piscataway

T2 - Industry Applications Conference, 2006. 41st IAS Annual Meeting, Tampa

Y2 - 8 October 2006 through 12 October 2006

ER -