Lifetime reliability assessment with aging information from low-level sensors

Y Wang; SD Cotofana; L Fang

doi:10.1145/2483028.2483132

Lifetime reliability assessment with aging information from low-level sensors

Computer Engineering

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	Proceedings of the 23rd ACM International Conference on Great Lakes Symposium on VLSI
Editors	J Ayala
Place of Publication	New York, NY, USA
Publisher	Association for Computing Machinery (ACM)
Pages	339-340
Number of pages	2
ISBN (Print)	978-1-4503-2032-0
DOIs	https://doi.org/10.1145/2483028.2483132
Publication status	Published - 2013
Event	GLSVLSI 2013, Paris, France - New York, NY, USA Duration: 2 May 2013 → 3 May 2013

Publication series

Name
Publisher	ACM

Conference

Conference	GLSVLSI 2013, Paris, France
Period	2/05/13 → 3/05/13

Bibliographical note

Harvest

Access to Document

10.1145/2483028.2483132

Cite this

@inproceedings{134dc358131648e69663252905fc48fc,

title = "Lifetime reliability assessment with aging information from low-level sensors",

author = "Y Wang and SD Cotofana and L Fang",

note = "Harvest; GLSVLSI 2013, Paris, France ; Conference date: 02-05-2013 Through 03-05-2013",

year = "2013",

doi = "10.1145/2483028.2483132",

language = "English",

isbn = "978-1-4503-2032-0",

publisher = "Association for Computing Machinery (ACM)",

pages = "339--340",

editor = "J Ayala",

booktitle = "Proceedings of the 23rd ACM International Conference on Great Lakes Symposium on VLSI",

address = "United States",

}

Wang, Y, Cotofana, SD & Fang, L 2013, Lifetime reliability assessment with aging information from low-level sensors. in J Ayala (ed.), Proceedings of the 23rd ACM International Conference on Great Lakes Symposium on VLSI. Association for Computing Machinery (ACM), New York, NY, USA, pp. 339-340, GLSVLSI 2013, Paris, France, 2/05/13. https://doi.org/10.1145/2483028.2483132

Lifetime reliability assessment with aging information from low-level sensors. / Wang, Y; Cotofana, SD; Fang, L.
Proceedings of the 23rd ACM International Conference on Great Lakes Symposium on VLSI. ed. / J Ayala. New York, NY, USA: Association for Computing Machinery (ACM), 2013. p. 339-340.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Lifetime reliability assessment with aging information from low-level sensors

AU - Wang, Y

AU - Cotofana, SD

AU - Fang, L

N1 - Harvest

PY - 2013

Y1 - 2013

U2 - 10.1145/2483028.2483132

DO - 10.1145/2483028.2483132

M3 - Conference contribution

SN - 978-1-4503-2032-0

SP - 339

EP - 340

BT - Proceedings of the 23rd ACM International Conference on Great Lakes Symposium on VLSI

A2 - Ayala, J

PB - Association for Computing Machinery (ACM)

CY - New York, NY, USA

T2 - GLSVLSI 2013, Paris, France

Y2 - 2 May 2013 through 3 May 2013

ER -