Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects

M Saadaoui, WHA Wien, HW van Zeijl, H Schellevis, M Laros, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

8 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProc. IEEE Sensors 2007 Conference
EditorsB Mizaikoff, PJ French
Place of PublicationAtlanta, Georgia
PublisherIEEE Society
Number of pages4
ISBN (Print)1-4244-1262-5
Publication statusPublished - 2007

Publication series



  • conference contrib. refereed
  • Conf.proc. > 3 pag

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