Localized stress near and the thermal expansion of AI 2 Cu precipitates in an AI thin film matrix.

JP Lokker, NM van der Pers, AH Verbruggen, GCAM Janssen, JF Jongste, S Radelaar

Research output: Contribution to journal › Article › Scientific › peer-review

Keywords

@article{cdab3b63da10470fac0595c1bfa0c962,

title = "Localized stress near and the thermal expansion of AI 2 Cu precipitates in an AI thin film matrix.",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "JP Lokker and {van der Pers}, NM and AH Verbruggen and GCAM Janssen and JF Jongste and S Radelaar",

year = "2000",

language = "Undefined/Unknown",

volume = "87",

pages = "682--688",

journal = "Journal of Applied Physics",

issn = "0021-8979",

publisher = "AIP Publishing",

number = "2",

}

TY - JOUR

T1 - Localized stress near and the thermal expansion of AI 2 Cu precipitates in an AI thin film matrix.

AU - Lokker, JP

AU - van der Pers, NM

AU - Verbruggen, AH

AU - Janssen, GCAM

AU - Jongste, JF

AU - Radelaar, S

PY - 2000

Y1 - 2000

KW - ZX Int.klas.verslagjaar < 2002

M3 - Article

SN - 0021-8979

VL - 87

SP - 682

EP - 688

JO - Journal of Applied Physics

JF - Journal of Applied Physics

IS - 2

ER -