Low-cost epoxy packaging of CMOS Hall-effect compasses (U-SP-2-I-ICT)

J van der Meer, KAA Makinwa, JH Huijsing, FR Riedijk, EJ van Kampen

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)
Original languageEnglish
Title of host publicationLow-cost epoxy packaging of CMOS Hall-effect compasses
Place of PublicationIrvine,CA,USA.
PublisherIEEE Society
Pages65-68
Number of pages4
Publication statusPublished - 2005
EventIEEE Sensors 2005 - Irvine, California, USA
Duration: 31 Oct 20053 Nov 2005

Conference

ConferenceIEEE Sensors 2005
Period31/10/053/11/05

Keywords

  • professional journal papers
  • Conf.proc. > 3 pag

Cite this

van der Meer, J., Makinwa, KAA., Huijsing, JH., Riedijk, FR., & van Kampen, EJ. (2005). Low-cost epoxy packaging of CMOS Hall-effect compasses (U-SP-2-I-ICT). In Low-cost epoxy packaging of CMOS Hall-effect compasses (pp. 65-68). IEEE Society.