Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits

S Vollebregt; R Ishihara; J van der Cingel; CIM Beenakker

doi:10.1109/3DIC.2012.6262989

Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits

S Vollebregt, R Ishihara, J van der Cingel, CIM Beenakker

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

6 Citations (Scopus)

Original language	English
Title of host publication	3rd IEEE International 3D Systems Integration Conference (3DIC 2012)
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	1-4
Number of pages	4
ISBN (Print)	978-1-4673-2189-1
DOIs	https://doi.org/10.1109/3DIC.2012.6262989
Publication status	Published - 2012
Event	3rd IEEE International 3D Systems Integration Conference (3DIC 2012), Osaka, Japan - Piscataway Duration: 31 Jan 2012 → 2 Feb 2012

Publication series

Name
Publisher	IEEE

Conference

Conference	3rd IEEE International 3D Systems Integration Conference (3DIC 2012), Osaka, Japan
Period	31/01/12 → 2/02/12

Keywords

Conf.proc. > 3 pag

Access to Document

10.1109/3DIC.2012.6262989

Cite this

@inproceedings{0d6512d910bb4076934690e1edb171fc,

title = "Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits",

keywords = "Conf.proc. > 3 pag",

author = "S Vollebregt and R Ishihara and {van der Cingel}, J and CIM Beenakker",

year = "2012",

doi = "10.1109/3DIC.2012.6262989",

language = "English",

isbn = "978-1-4673-2189-1",

publisher = "IEEE Society",

pages = "1--4",

booktitle = "3rd IEEE International 3D Systems Integration Conference (3DIC 2012)",

note = "3rd IEEE International 3D Systems Integration Conference (3DIC 2012), Osaka, Japan ; Conference date: 31-01-2012 Through 02-02-2012",

}

Vollebregt, S , Ishihara, R , van der Cingel, J & Beenakker, CIM 2012, Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits. in 3rd IEEE International 3D Systems Integration Conference (3DIC 2012). IEEE Society, Piscataway, pp. 1-4, 3rd IEEE International 3D Systems Integration Conference (3DIC 2012), Osaka, Japan, 31/01/12. https://doi.org/10.1109/3DIC.2012.6262989

Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits. / Vollebregt, S ; Ishihara, R ; van der Cingel, J et al.
3rd IEEE International 3D Systems Integration Conference (3DIC 2012). Piscataway: IEEE Society, 2012. p. 1-4.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits

AU - Vollebregt, S

AU - Ishihara, R

AU - van der Cingel, J

AU - Beenakker, CIM

PY - 2012

Y1 - 2012

KW - Conf.proc. > 3 pag

U2 - 10.1109/3DIC.2012.6262989

DO - 10.1109/3DIC.2012.6262989

M3 - Conference contribution

SN - 978-1-4673-2189-1

SP - 1

EP - 4

BT - 3rd IEEE International 3D Systems Integration Conference (3DIC 2012)

PB - IEEE Society

CY - Piscataway

T2 - 3rd IEEE International 3D Systems Integration Conference (3DIC 2012), Osaka, Japan

Y2 - 31 January 2012 through 2 February 2012

ER -