Low temperature deposition of TiN by plasma-assisted atomic layer deposition for system-in-package applications

SBS Heil; E Langereis; F Roozeboom; PM Sarro; MCM van de Sanden; WMM Kessels

Low temperature deposition of TiN by plasma-assisted atomic layer deposition for system-in-package applications

SBS Heil, E Langereis, F Roozeboom, PM Sarro, MCM van de Sanden, WMM Kessels

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005)
Editors	s.n.
Place of Publication	Utrecht
Publisher	Dutch Technology Foundation
Pages	92-95
Number of pages	4
ISBN (Print)	90-73461-50-2
Publication status	Published - 2005
Event	STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005), Veldhoven, the Netherlands - Utrecht Duration: 17 Nov 2005 → 18 Nov 2005

Publication series

Name
Publisher	Dutch Technology Foundation

Conference

Conference	STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005), Veldhoven, the Netherlands
Period	17/11/05 → 18/11/05

Bibliographical note

Editor onbekend JH/STW

Keywords

Vakpubl., Overig wet. > 3 pag

Cite this

Heil, SBS., Langereis, E., Roozeboom, F., Sarro, PM., van de Sanden, MCM., & Kessels, WMM. (2005). Low temperature deposition of TiN by plasma-assisted atomic layer deposition for system-in-package applications. In s.n. (Ed.), Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005) (pp. 92-95). Dutch Technology Foundation.

@inproceedings{a9e9694a8ac84e2095db0473918df1d4,

title = "Low temperature deposition of TiN by plasma-assisted atomic layer deposition for system-in-package applications",

keywords = "Vakpubl., Overig wet. > 3 pag",

author = "SBS Heil and E Langereis and F Roozeboom and PM Sarro and {van de Sanden}, MCM and WMM Kessels",

note = "Editor onbekend JH/STW; STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005), Veldhoven, the Netherlands ; Conference date: 17-11-2005 Through 18-11-2005",

year = "2005",

language = "Undefined/Unknown",

isbn = "90-73461-50-2",

publisher = "Dutch Technology Foundation",

pages = "92--95",

editor = "s.n.",

booktitle = "Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005)",

}

Heil, SBS, Langereis, E, Roozeboom, F, Sarro, PM, van de Sanden, MCM & Kessels, WMM 2005, Low temperature deposition of TiN by plasma-assisted atomic layer deposition for system-in-package applications. in s.n. (ed.), Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005). Dutch Technology Foundation, Utrecht, pp. 92-95, STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005), Veldhoven, the Netherlands, 17/11/05.

Low temperature deposition of TiN by plasma-assisted atomic layer deposition for system-in-package applications. / Heil, SBS; Langereis, E; Roozeboom, F et al.
Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005). ed. / s.n. Utrecht: Dutch Technology Foundation, 2005. p. 92-95.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Low temperature deposition of TiN by plasma-assisted atomic layer deposition for system-in-package applications

AU - Heil, SBS

AU - Langereis, E

AU - Roozeboom, F

AU - Sarro, PM

AU - van de Sanden, MCM

AU - Kessels, WMM

N1 - Editor onbekend JH/STW

PY - 2005

Y1 - 2005

KW - Vakpubl., Overig wet. > 3 pag

M3 - Conference contribution

SN - 90-73461-50-2

SP - 92

EP - 95

BT - Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005)

A2 - s.n., null

PB - Dutch Technology Foundation

CY - Utrecht

T2 - STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005), Veldhoven, the Netherlands

Y2 - 17 November 2005 through 18 November 2005

ER -

Heil SBS, Langereis E, Roozeboom F, Sarro PM, van de Sanden MCM, Kessels WMM. Low temperature deposition of TiN by plasma-assisted atomic layer deposition for system-in-package applications. In s.n., editor, Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005). Utrecht: Dutch Technology Foundation. 2005. p. 92-95