Low-temperature wafer-level packaging of a MEMS microreactor with a lateral feedthrough by local PECVD TEOS deposition

L Mele, B Morana, CR de Boer, JF Creemer, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationProceeding title: Proceedings of the Eurosensors XXIII Conference
EditorsJ Brugger, D Briand
Place of PublicationLausanne, Switzerland
PublisherElsevier
Pages1531-1534
Number of pages4
Publication statusPublished - 2009
EventEurosensors XXIII - Lausanne, Switzerland
Duration: 6 Sep 20099 Sep 2009

Publication series

Name
PublisherElsevier

Conference

ConferenceEurosensors XXIII
CountrySwitzerland
CityLausanne
Period6/09/099/09/09

Keywords

  • Conf.proc. > 3 pag

Cite this

Mele, L., Morana, B., de Boer, CR., Creemer, JF., & Sarro, PM. (2009). Low-temperature wafer-level packaging of a MEMS microreactor with a lateral feedthrough by local PECVD TEOS deposition. In J. Brugger, & D. Briand (Eds.), Proceeding title: Proceedings of the Eurosensors XXIII Conference (pp. 1531-1534). Elsevier.