Low-temperature wafer-level packaging of a MEMS microreactor with a lateral feedthrough by local PECVD TEOS deposition

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceeding title: Proceedings of the Eurosensors XXIII Conference
Editors	J Brugger, D Briand
Place of Publication	Lausanne, Switzerland
Publisher	Elsevier
Pages	1531-1534
Number of pages	4
Publication status	Published - 2009
Event	Eurosensors XXIII - Lausanne, Switzerland Duration: 6 Sept 2009 → 9 Sept 2009

Name
Publisher	Elsevier

Keywords

@inproceedings{840474bcb95e41d096cf471ad8a421a6,

title = "Low-temperature wafer-level packaging of a MEMS microreactor with a lateral feedthrough by local PECVD TEOS deposition",

keywords = "Conf.proc. > 3 pag",

author = "L Mele and B Morana and {de Boer}, CR and JF Creemer and PM Sarro",

year = "2009",

language = "Undefined/Unknown",

publisher = "Elsevier",

pages = "1531--1534",

editor = "J Brugger and D Briand",

booktitle = "Proceeding title: Proceedings of the Eurosensors XXIII Conference",

note = "Eurosensors XXIII ; Conference date: 06-09-2009 Through 09-09-2009",

}

Mele, L, Morana, B , de Boer, CR, Creemer, JF & Sarro, PM 2009, Low-temperature wafer-level packaging of a MEMS microreactor with a lateral feedthrough by local PECVD TEOS deposition. in J Brugger & D Briand (eds), Proceeding title: Proceedings of the Eurosensors XXIII Conference. Elsevier, Lausanne, Switzerland, pp. 1531-1534, Eurosensors XXIII, Lausanne, Switzerland, 6/09/09.

Low-temperature wafer-level packaging of a MEMS microreactor with a lateral feedthrough by local PECVD TEOS deposition. / Mele, L; Morana, B ; de Boer, CR et al.
Proceeding title: Proceedings of the Eurosensors XXIII Conference. ed. / J Brugger; D Briand. Lausanne, Switzerland: Elsevier, 2009. p. 1531-1534.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Low-temperature wafer-level packaging of a MEMS microreactor with a lateral feedthrough by local PECVD TEOS deposition

AU - Mele, L

AU - Morana, B

AU - de Boer, CR

AU - Creemer, JF

AU - Sarro, PM

PY - 2009

Y1 - 2009

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 1531

EP - 1534

BT - Proceeding title: Proceedings of the Eurosensors XXIII Conference

A2 - Brugger, J

A2 - Briand, D

PB - Elsevier

CY - Lausanne, Switzerland

T2 - Eurosensors XXIII

Y2 - 6 September 2009 through 9 September 2009

ER -