| Original language | English |
|---|---|
| Patent number | US 9.620.625 |
| IPC | H01L |
| Priority date | 29/01/13 |
| Publication status | Published - 2017 |
Manufacture a submicron structure using a liquid precursor
Michiel van der Zwan (Inventor), Ryoichi Ishihara (Inventor), Miki Trifunovic (Inventor)
Research output: Patent