Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages

Romina  Sattari; Henk van Zeijl; Guoqi Zhang

doi:10.1109/EuroSimE56861.2023.10100771

Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages

Romina Sattari^*, Henk van Zeijl, Guoqi Zhang

^*Corresponding author for this work

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

41 Downloads (Pure)

Abstract

This study presents the design and fabrication of an in-package relative humidity sensor for epoxy molding compound (EMC) packages. The sensor comprises shielded interdigital electrodes (SIDE) for in-situ monitoring of humidity absorption/desorption in the package encapsulation layer. A novel approach is employed in the device fabrication to maximize the electrical field lines to pass through the EMC and enhance the sensitivity. The manufactured wafer includes 6×6mm2 dies, each containing six identical capacitive sensors with an area of 480 × 620 μ m2. SU-8 through polymer vias (TPVs) with high aspect ratio were created to locally mold the sensors by EMC. The linear capacitance change with the relative humidity level is simulated in COMSOL Multiphysics. Three designs were compared, and the calibration results show the capacitance value of 1.54 pF and 5.85 pF before and after molding, respectively. The capacitance value stays within the range of 5.85 to 5.86 pF with less than 7 aF variation under different biasing voltages, indicating the stability and robustness of the capacitance.

Original language	English
Title of host publication	Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Publisher	IEEE
Pages	1-6
Number of pages	6
ISBN (Electronic)	979-8-3503-4597-1
ISBN (Print)	979-8-3503-4598-8
DOIs	https://doi.org/10.1109/EuroSimE56861.2023.10100771
Publication status	Published - 2023
Event	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Graz, Austria Duration: 16 Apr 2023 → 19 Apr 2023 Conference number: 24th

Publication series

Name	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Conference

Conference	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Country/Territory	Austria
City	Graz
Period	16/04/23 → 19/04/23

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

Electromagnetic compatibility
In-package relative humidity sensor
epoxy molding compound
shielded interdigital electrodes
encapsulation layer
electrical field lines
through polymer vias

Access to Document

10.1109/EuroSimE56861.2023.10100771

Manufacturing_of_an_In-Package_Relative_Humidity_Sensor_for_Epoxy_Molding_Compound_PackagesFinal published version, 4.6 MB

Cite this

Sattari, R., van Zeijl, H., & Zhang, G. (2023). Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages. In Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (pp. 1-6). (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). IEEE. https://doi.org/10.1109/EuroSimE56861.2023.10100771

Sattari, Romina ; van Zeijl, Henk ; Zhang, Guoqi. / Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages. Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2023. pp. 1-6 (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

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title = "Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages",

abstract = "This study presents the design and fabrication of an in-package relative humidity sensor for epoxy molding compound (EMC) packages. The sensor comprises shielded interdigital electrodes (SIDE) for in-situ monitoring of humidity absorption/desorption in the package encapsulation layer. A novel approach is employed in the device fabrication to maximize the electrical field lines to pass through the EMC and enhance the sensitivity. The manufactured wafer includes 6×6mm2 dies, each containing six identical capacitive sensors with an area of 480 × 620 μ m2. SU-8 through polymer vias (TPVs) with high aspect ratio were created to locally mold the sensors by EMC. The linear capacitance change with the relative humidity level is simulated in COMSOL Multiphysics. Three designs were compared, and the calibration results show the capacitance value of 1.54 pF and 5.85 pF before and after molding, respectively. The capacitance value stays within the range of 5.85 to 5.86 pF with less than 7 aF variation under different biasing voltages, indicating the stability and robustness of the capacitance.",

keywords = "Electromagnetic compatibility, In-package relative humidity sensor, epoxy molding compound, shielded interdigital electrodes, encapsulation layer, electrical field lines, through polymer vias",

author = "Romina Sattari and {van Zeijl}, Henk and Guoqi Zhang",

note = "Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.; 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ; Conference date: 16-04-2023 Through 19-04-2023",

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Sattari, R , van Zeijl, H & Zhang, G 2023, Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages. in Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, IEEE, pp. 1-6, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz, Austria, 16/04/23. https://doi.org/10.1109/EuroSimE56861.2023.10100771

Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages. / Sattari, Romina ; van Zeijl, Henk ; Zhang, Guoqi.
Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2023. p. 1-6 (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages

AU - Sattari, Romina

AU - van Zeijl, Henk

AU - Zhang, Guoqi

N1 - Conference code: 24th

PY - 2023

Y1 - 2023

N2 - This study presents the design and fabrication of an in-package relative humidity sensor for epoxy molding compound (EMC) packages. The sensor comprises shielded interdigital electrodes (SIDE) for in-situ monitoring of humidity absorption/desorption in the package encapsulation layer. A novel approach is employed in the device fabrication to maximize the electrical field lines to pass through the EMC and enhance the sensitivity. The manufactured wafer includes 6×6mm2 dies, each containing six identical capacitive sensors with an area of 480 × 620 μ m2. SU-8 through polymer vias (TPVs) with high aspect ratio were created to locally mold the sensors by EMC. The linear capacitance change with the relative humidity level is simulated in COMSOL Multiphysics. Three designs were compared, and the calibration results show the capacitance value of 1.54 pF and 5.85 pF before and after molding, respectively. The capacitance value stays within the range of 5.85 to 5.86 pF with less than 7 aF variation under different biasing voltages, indicating the stability and robustness of the capacitance.

AB - This study presents the design and fabrication of an in-package relative humidity sensor for epoxy molding compound (EMC) packages. The sensor comprises shielded interdigital electrodes (SIDE) for in-situ monitoring of humidity absorption/desorption in the package encapsulation layer. A novel approach is employed in the device fabrication to maximize the electrical field lines to pass through the EMC and enhance the sensitivity. The manufactured wafer includes 6×6mm2 dies, each containing six identical capacitive sensors with an area of 480 × 620 μ m2. SU-8 through polymer vias (TPVs) with high aspect ratio were created to locally mold the sensors by EMC. The linear capacitance change with the relative humidity level is simulated in COMSOL Multiphysics. Three designs were compared, and the calibration results show the capacitance value of 1.54 pF and 5.85 pF before and after molding, respectively. The capacitance value stays within the range of 5.85 to 5.86 pF with less than 7 aF variation under different biasing voltages, indicating the stability and robustness of the capacitance.

KW - Electromagnetic compatibility

KW - In-package relative humidity sensor

KW - epoxy molding compound

KW - shielded interdigital electrodes

KW - encapsulation layer

KW - electrical field lines

KW - through polymer vias

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U2 - 10.1109/EuroSimE56861.2023.10100771

DO - 10.1109/EuroSimE56861.2023.10100771

M3 - Conference contribution

SN - 979-8-3503-4598-8

T3 - 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

SP - 1

EP - 6

BT - Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

PB - IEEE

T2 - 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Y2 - 16 April 2023 through 19 April 2023

ER -

Sattari R , van Zeijl H , Zhang G. Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages. In Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE. 2023. p. 1-6. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). doi: 10.1109/EuroSimE56861.2023.10100771

Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages

Abstract

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Keywords

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