Reduced thermomechanical models are needed for the next generation precision devices. One of the methods is thermal modal analysis, which decomposes the behaviour into thermal modes and time constants. This study aims to measure these modal parameters. We isolated the behaviour of a single thermal mode exciting the system in the test set-up by this mode. The measured responses as well as the modal contributions are in good agreement with the simulations. Thus, thermal modal analysis can provide a basis for design optimiztion and compensation strategies.
|Conference||12th international conference of the european society for precision engineering and nanotechnology (euspen), Stockholm, Sweden|
|Period||4/06/12 → 7/06/12|
- conference contrib. refereed
- Conf.proc. > 3 pag