Measured thermal modes for design optimization

EC Hooijkamp, R Saathof, F van Keulen, J van Eijk

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

Reduced thermomechanical models are needed for the next generation precision devices. One of the methods is thermal modal analysis, which decomposes the behaviour into thermal modes and time constants. This study aims to measure these modal parameters. We isolated the behaviour of a single thermal mode exciting the system in the test set-up by this mode. The measured responses as well as the modal contributions are in good agreement with the simulations. Thus, thermal modal analysis can provide a basis for design optimiztion and compensation strategies.
Original languageEnglish
Title of host publicationProceedings of the 12th international conference of the european society for precision engineering and nanotechnology (euspen), June 4th-7th 2012, Stockholm, Sweden
EditorsP Shore, H Spaan, T Burke
Place of PublicationStockholm, Sweden
PublisherEUSPEN
Pages416-419
Number of pages4
ISBN (Print)978-0-9566790-0-0
Publication statusPublished - 2012
Event12th international conference of the european society for precision engineering and nanotechnology (euspen), Stockholm, Sweden - Stockholm, Sweden
Duration: 4 Jun 20127 Jun 2012

Publication series

Name
PublisherEuspen
Name
Volume2

Conference

Conference12th international conference of the european society for precision engineering and nanotechnology (euspen), Stockholm, Sweden
Period4/06/127/06/12

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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