Measuring in-thickness mechanical properties of sub micron polymer dielectric films

M van Soestbergen; LJ Ernst; KMB Jansen; WD van Driel; M Bartek; A Polyakov

Measuring in-thickness mechanical properties of sub micron polymer dielectric films

M van Soestbergen
, LJ Ernst
, KMB Jansen
, WD van Driel
, M Bartek
, A Polyakov

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Editors	Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M., Saint Leger, O. de
Place of Publication	Como, Italy
Publisher	EuroSimE
Pages	1-5
Number of pages	5
ISBN (Print)	1-4244-0272X
Publication status	Published - 2006
Event	EuroSimE 2006: 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy Duration: 24 Apr 2006 → 26 Apr 2006 Conference number: 7

Publication series

Name
Publisher	EuroSimE

Conference

Conference	EuroSimE 2006
Country/Territory	Italy
City	Como
Period	24/04/06 → 26/04/06

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

van Soestbergen, M., Ernst, LJ., Jansen, KMB., van Driel, WD., Bartek, M., & Polyakov, A. (2006). Measuring in-thickness mechanical properties of sub micron polymer dielectric films. In Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M., & Saint Leger, O. de (Eds.), Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006 (pp. 1-5). EuroSimE.

van Soestbergen, M ; Ernst, LJ ; Jansen, KMB et al. / Measuring in-thickness mechanical properties of sub micron polymer dielectric films. Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. editor / Ernst, L.J. ; Zhang, G.Q. ; Rodgers, P. ; Marco, S. ; Meuwissen, M. ; Saint Leger, O. de. Como, Italy : EuroSimE, 2006. pp. 1-5

@inproceedings{060cdd98c5fa470ca99c9d4410122106,

title = "Measuring in-thickness mechanical properties of sub micron polymer dielectric films",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "\{van Soestbergen\}, M and LJ Ernst and KMB Jansen and \{van Driel\}, WD and M Bartek and A Polyakov",

year = "2006",

language = "Undefined/Unknown",

isbn = "1-4244-0272X",

publisher = "EuroSimE",

pages = "1--5",

editor = "\{Ernst, L.J.\} and \{Zhang, G.Q.\} and \{Rodgers, P.\} and \{Marco, S.\} and \{Meuwissen, M.\} and \{Saint Leger, O. de\}",

booktitle = "Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006",

note = "EuroSimE 2006 ; Conference date: 24-04-2006 Through 26-04-2006",

}

van Soestbergen, M, Ernst, LJ, Jansen, KMB , van Driel, WD, Bartek, M & Polyakov, A 2006, Measuring in-thickness mechanical properties of sub micron polymer dielectric films. in Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds), Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. EuroSimE, Como, Italy, pp. 1-5, EuroSimE 2006, Como, Italy, 24/04/06.

Measuring in-thickness mechanical properties of sub micron polymer dielectric films. / van Soestbergen, M; Ernst, LJ; Jansen, KMB et al.
Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. ed. / Ernst, L.J.; Zhang, G.Q.; Rodgers, P.; Marco, S.; Meuwissen, M.; Saint Leger, O. de. Como, Italy: EuroSimE, 2006. p. 1-5.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Measuring in-thickness mechanical properties of sub micron polymer dielectric films

AU - van Soestbergen, M

AU - Ernst, LJ

AU - Jansen, KMB

AU - van Driel, WD

AU - Bartek, M

AU - Polyakov, A

N1 - Conference code: 7

PY - 2006

Y1 - 2006

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 1-4244-0272X

SP - 1

EP - 5

BT - Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

A2 - Ernst, L.J., null

A2 - Zhang, G.Q., null

A2 - Rodgers, P., null

A2 - Marco, S., null

A2 - Meuwissen, M., null

A2 - Saint Leger, O. de, null

PB - EuroSimE

CY - Como, Italy

T2 - EuroSimE 2006

Y2 - 24 April 2006 through 26 April 2006

ER -

van Soestbergen M, Ernst LJ, Jansen KMB , van Driel WD, Bartek M, Polyakov A. Measuring in-thickness mechanical properties of sub micron polymer dielectric films. In Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M., Saint Leger, O. de, editors, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Como, Italy: EuroSimE. 2006. p. 1-5