@inproceedings{d14af45bd2ba414ab5416cb011d58676,
title = "Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip",
author = "F Rost and F Schindler-Saefkow and {Rezaie Adli}, AR and KMB Jansen and B Wunderle and J Keller and S Rzepka and B Michel",
year = "2014",
doi = "10.1109/EuroSimE.2014.6813807",
language = "English",
isbn = "978-1-4799-4791-1",
pages = "1--5",
editor = "B Vandevelde",
booktitle = "Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems",
publisher = "IEEE Society",
note = "EuroSimE 2014 : IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 07-04-2014 Through 09-04-2014",
}