Mechanical characterization and modeling of low-dielectric-constant SiLK films using nano-indentation: time- and temperature-effects

J den Toonder; A van Dijken; V Gonda; J Beijer; K Zhang; LJ Ernst

Mechanical characterization and modeling of low-dielectric-constant SiLK films using nano-indentation: time- and temperature-effects

J den Toonder, A van Dijken, V Gonda, J Beijer, K Zhang, LJ Ernst

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

11 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	53rd electronic components & technology conference
Editors	SK Sitaraman, M Lamson
Place of Publication	Piscataway
Publisher	IEEE
Pages	708-713
Number of pages	6
ISBN (Print)	0-7803-7991-5
Publication status	Published - 2003
Event	53rd electronic components & technology conference - New Orleans, United States Duration: 27 May 2003 → 30 May 2003

Publication series

Name
Publisher	IEEE

Conference

Conference	53rd electronic components & technology conference
Country/Territory	United States
City	New Orleans
Period	27/05/03 → 30/05/03

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{ec14f0ee422f4ff0b7e0e672c3df7efd,

title = "Mechanical characterization and modeling of low-dielectric-constant SiLK films using nano-indentation: time- and temperature-effects",

keywords = "Conf.proc. > 3 pag",

author = "{den Toonder}, J and {van Dijken}, A and V Gonda and J Beijer and K Zhang and LJ Ernst",

year = "2003",

language = "Undefined/Unknown",

isbn = "0-7803-7991-5",

publisher = "IEEE",

pages = "708--713",

editor = "SK Sitaraman and M Lamson",

booktitle = "53rd electronic components & technology conference",

address = "United States",

note = "53rd electronic components & technology conference ; Conference date: 27-05-2003 Through 30-05-2003",

}

den Toonder, J, van Dijken, A, Gonda, V, Beijer, J, Zhang, K & Ernst, LJ 2003, Mechanical characterization and modeling of low-dielectric-constant SiLK films using nano-indentation: time- and temperature-effects. in SK Sitaraman & M Lamson (eds), 53rd electronic components & technology conference. IEEE, Piscataway, pp. 708-713, 53rd electronic components & technology conference, New Orleans, United States, 27/05/03.

Mechanical characterization and modeling of low-dielectric-constant SiLK films using nano-indentation: time- and temperature-effects. / den Toonder, J; van Dijken, A; Gonda, V et al.
53rd electronic components & technology conference. ed. / SK Sitaraman; M Lamson. Piscataway: IEEE, 2003. p. 708-713.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Mechanical characterization and modeling of low-dielectric-constant SiLK films using nano-indentation: time- and temperature-effects

AU - den Toonder, J

AU - van Dijken, A

AU - Gonda, V

AU - Beijer, J

AU - Zhang, K

AU - Ernst, LJ

PY - 2003

Y1 - 2003

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-7991-5

SP - 708

EP - 713

BT - 53rd electronic components & technology conference

A2 - Sitaraman, SK

A2 - Lamson, M

PB - IEEE

CY - Piscataway

T2 - 53rd electronic components & technology conference

Y2 - 27 May 2003 through 30 May 2003

ER -