Mechanical characterization of deformable ultra-thin substrates by experiment and FE simulation

L WANG; T Zoumpoulidis; KMB Jansen; M Bartek; GQ Zhang; LJ Ernst

Mechanical characterization of deformable ultra-thin substrates by experiment and FE simulation

L WANG, T Zoumpoulidis, KMB Jansen, M Bartek, GQ Zhang, LJ Ernst

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proc. 57th Electronic Components & Technology Conference (ECTC 2007)
Editors	Bonda R
Place of Publication	Piscataway
Publisher	IEEE
Pages	1056-1061
Number of pages	6
ISBN (Print)	1-4244-0984
Publication status	Published - 2007
Event	57th Electronic Components & Technology Conference (ECTC 2007) - Piscataway Duration: 29 May 2007 → 1 Jun 2007

Publication series

Name
Publisher	IEEE

Conference

Conference	57th Electronic Components & Technology Conference (ECTC 2007)
Period	29/05/07 → 1/06/07

Keywords

Elektrotechniek
conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{12e318638a094d73bbc735a8ecc16d79,

title = "Mechanical characterization of deformable ultra-thin substrates by experiment and FE simulation",

keywords = "Elektrotechniek, conference contrib. refereed, Conf.proc. > 3 pag",

author = "L WANG and T Zoumpoulidis and KMB Jansen and M Bartek and GQ Zhang and LJ Ernst",

year = "2007",

language = "Undefined/Unknown",

isbn = "1-4244-0984",

publisher = "IEEE",

pages = "1056--1061",

editor = "{Bonda R}",

booktitle = "Proc. 57th Electronic Components & Technology Conference (ECTC 2007)",

address = "United States",

note = "57th Electronic Components & Technology Conference (ECTC 2007) ; Conference date: 29-05-2007 Through 01-06-2007",

}

Mechanical characterization of deformable ultra-thin substrates by experiment and FE simulation. / WANG, L; Zoumpoulidis, T; Jansen, KMB et al.
Proc. 57th Electronic Components & Technology Conference (ECTC 2007). ed. / Bonda R. Piscataway: IEEE, 2007. p. 1056-1061.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Mechanical characterization of deformable ultra-thin substrates by experiment and FE simulation

AU - WANG, L

AU - Zoumpoulidis, T

AU - Jansen, KMB

AU - Bartek, M

AU - Zhang, GQ

AU - Ernst, LJ

PY - 2007

Y1 - 2007

KW - Elektrotechniek

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 1-4244-0984

SP - 1056

EP - 1061

BT - Proc. 57th Electronic Components & Technology Conference (ECTC 2007)

A2 - Bonda R, null

PB - IEEE

CY - Piscataway

T2 - 57th Electronic Components & Technology Conference (ECTC 2007)

Y2 - 29 May 2007 through 1 June 2007

ER -