Mechanical modeling and characterization of the curing process of underfill materials

LJ Ernst, C van t Hof, D Yang, GQ Zhang, HJL Bressers, JFJ Caers, AWJ den Boer, J Janssen

Research output: Contribution to journalArticlepeer-review

45 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)97-105
Number of pages9
JournalJournal of Electronic Packaging
Publication statusPublished - 2002


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