Mechanical modeling and characterization of the curing process of underfill materials

LJ Ernst, C van t Hof, D Yang, GQ Zhang, HJL Bressers, JFJ Caers, AWJ den Boer, J Janssen

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	Undefined/Unknown
Pages (from-to)	97-105
Number of pages	9
Journal	Journal of Electronic Packaging
Volume	124
Publication status	Published - 2002

Keywords

@article{4428a433da204723bbef6b133e5f6d40,

title = "Mechanical modeling and characterization of the curing process of underfill materials",

keywords = "ZX CWTS 1.00 <= JFIS < 3.00",

author = "LJ Ernst and {van t Hof}, C and D Yang and GQ Zhang and HJL Bressers and JFJ Caers and {den Boer}, AWJ and J Janssen",

year = "2002",

language = "Undefined/Unknown",

volume = "124",

pages = "97--105",

journal = "Journal of Electronic Packaging",

issn = "1043-7398",

publisher = "ASME",

}

TY - JOUR

T1 - Mechanical modeling and characterization of the curing process of underfill materials

AU - Ernst, LJ

AU - van t Hof, C

AU - Yang, D

AU - Zhang, GQ

AU - Bressers, HJL

AU - Caers, JFJ

AU - den Boer, AWJ

AU - Janssen, J

PY - 2002

Y1 - 2002

KW - ZX CWTS 1.00 <= JFIS < 3.00

M3 - Article

SN - 1043-7398

VL - 124

SP - 97

EP - 105

JO - Journal of Electronic Packaging

JF - Journal of Electronic Packaging

ER -