@inproceedings{b727afc2b56549e0a105213ed2c590d0,
title = "Mechanical Properties of Polymer Dielectric Films at Elevated Temperatures",
abstract = "The miniaturization of microelectronics has led to the use of polmer dielectric films with a thickness less than a micrometer. The use of polymer dielectric films has introduced new failure modes. To have a better understanding of these failures, knowledge of the mechanical properties is necessary.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "{van Soestbergen}, M and LJ Ernst and KMB Jansen and {van Driel}, WD",
year = "2006",
language = "Undefined/Unknown",
isbn = "1-4244-0620-X",
publisher = "IEEE",
pages = "664--667",
editor = "{Sheng Liu}",
booktitle = "Proceedings of 2006 7th International Conference on Electronics Packaging Technology",
address = "United States",
note = "2006 7th International Conference on Electronics Packaging Technology ; Conference date: 26-08-2006 Through 29-08-2006",
}