Mechanical Properties of Polymer Dielectric Films at Elevated Temperatures

M van Soestbergen, LJ Ernst, KMB Jansen, WD van Driel

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Abstract

The miniaturization of microelectronics has led to the use of polmer dielectric films with a thickness less than a micrometer. The use of polymer dielectric films has introduced new failure modes. To have a better understanding of these failures, knowledge of the mechanical properties is necessary.
Original languageUndefined/Unknown
Title of host publicationProceedings of 2006 7th International Conference on Electronics Packaging Technology
Editors Sheng Liu
Place of PublicationShanghai, China
PublisherIEEE
Pages664-667
Number of pages4
ISBN (Print)1-4244-0620-X
Publication statusPublished - 2006
Event2006 7th International Conference on Electronics Packaging Technology - Shanghai. China
Duration: 26 Aug 200629 Aug 2006

Publication series

Name
PublisherInstitute of Electrical and Electronic Engineers, Inc.

Conference

Conference2006 7th International Conference on Electronics Packaging Technology
Period26/08/0629/08/06

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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