Mechanical reliability challenges for MEMS packages: Capping

WD van Driel, D Yang, CA Yuan, M van Kleef, GQ Zhang

Research output: Contribution to journalArticleScientificpeer-review

12 Citations (Scopus)

Abstract

This paper presents our effort to predict reliability problems for MEMS packages. MEMS devices are vulnerable to the external loads subjected to it. As such, MEMS devices need to be protected. Protections can be generated by capping the device: a piece of silicon is placed on top of it to create a cavity above it. Parametric finite element models are combined with dedicated verification experiments to address the reliability of four different capping concepts. The results gain a better understandig of MEMS capping issues, with failure modes as cavity deflection, cap fractures, and moisture penetration.
Original languageUndefined/Unknown
Pages (from-to)1823-1826
Number of pages4
JournalMicroelectronics Reliability
Volume47
Publication statusPublished - 2007

Keywords

  • academic journal papers
  • CWTS JFIS < 0.75

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