Mechanical Reliability of MEMS Packages

WD van Driel; JJM Zaal; D Yang; M van Kleef; GQ Zhang

Mechanical Reliability of MEMS Packages

WD van Driel, JJM Zaal, D Yang, M van Kleef, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Abstract

This paper presents our effort to predict reliability problems for MEMS packages. MEMS devices are vulnerable to the external loads subjected to it. As such, MEMS devices need to be protected. Capping the device can generate protections: a piece of silicon is placed on top of it to create a cavity above it. Parametric Finite Element models are combined with dedicated verification experiments to address the reliability of four different capping concepts. The results gain a better understanding of MEMS capping issues, with failure modes as cavity deflection, cap fractures, and moisture penetration.

Original language	Undefined/Unknown
Title of host publication	2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA
Editors	Wipiejewski, T., Trewhella, J.
Place of Publication	Orlando, FL, USA
Publisher	IEEE Society
Pages	1751-1754
Number of pages	4
ISBN (Print)	978-1-4244-2231-9
Publication status	Published - 2008
Event	58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA - Orlando, FL, USA Duration: 27 May 2008 → 30 May 2008

Publication series

Name
Publisher	IEEE

Conference

Conference	58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA
Period	27/05/08 → 30/05/08

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{d7c0430194484abcb680e627806536a5,

title = "Mechanical Reliability of MEMS Packages",

abstract = "This paper presents our effort to predict reliability problems for MEMS packages. MEMS devices are vulnerable to the external loads subjected to it. As such, MEMS devices need to be protected. Capping the device can generate protections: a piece of silicon is placed on top of it to create a cavity above it. Parametric Finite Element models are combined with dedicated verification experiments to address the reliability of four different capping concepts. The results gain a better understanding of MEMS capping issues, with failure modes as cavity deflection, cap fractures, and moisture penetration.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "{van Driel}, WD and JJM Zaal and D Yang and {van Kleef}, M and GQ Zhang",

year = "2008",

language = "Undefined/Unknown",

isbn = "978-1-4244-2231-9",

publisher = "IEEE Society",

pages = "1751--1754",

editor = "{Wipiejewski, T.} and {Trewhella, J.}",

booktitle = "2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA",

note = "58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA ; Conference date: 27-05-2008 Through 30-05-2008",

}

van Driel, WD, Zaal, JJM, Yang, D, van Kleef, M & Zhang, GQ 2008, Mechanical Reliability of MEMS Packages. in Wipiejewski, T. & Trewhella, J. (eds), 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. IEEE Society, Orlando, FL, USA, pp. 1751-1754, 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA, 27/05/08.

Mechanical Reliability of MEMS Packages. / van Driel, WD; Zaal, JJM; Yang, D et al.
2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. ed. / Wipiejewski, T.; Trewhella, J. Orlando, FL, USA: IEEE Society, 2008. p. 1751-1754.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Mechanical Reliability of MEMS Packages

AU - van Driel, WD

AU - Zaal, JJM

AU - Yang, D

AU - van Kleef, M

AU - Zhang, GQ

PY - 2008

Y1 - 2008

N2 - This paper presents our effort to predict reliability problems for MEMS packages. MEMS devices are vulnerable to the external loads subjected to it. As such, MEMS devices need to be protected. Capping the device can generate protections: a piece of silicon is placed on top of it to create a cavity above it. Parametric Finite Element models are combined with dedicated verification experiments to address the reliability of four different capping concepts. The results gain a better understanding of MEMS capping issues, with failure modes as cavity deflection, cap fractures, and moisture penetration.

AB - This paper presents our effort to predict reliability problems for MEMS packages. MEMS devices are vulnerable to the external loads subjected to it. As such, MEMS devices need to be protected. Capping the device can generate protections: a piece of silicon is placed on top of it to create a cavity above it. Parametric Finite Element models are combined with dedicated verification experiments to address the reliability of four different capping concepts. The results gain a better understanding of MEMS capping issues, with failure modes as cavity deflection, cap fractures, and moisture penetration.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-2231-9

SP - 1751

EP - 1754

BT - 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA

A2 - Wipiejewski, T., null

A2 - Trewhella, J., null

PB - IEEE Society

CY - Orlando, FL, USA

T2 - 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA

Y2 - 27 May 2008 through 30 May 2008

ER -