Mechanical reliability of micromachined silicon wafers with deep rectangular recesses and Via-Hole fences

A Poliakov, M Bartek, JN Burghartz

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Original languageUndefined/Unknown
    Title of host publicationEurosensors XVI 16th European Conference on Solid-State Transducers
    EditorsJ Saneistr, P Ripka
    Place of PublicationPraha, Czech Republik
    PublisherCzech Technical University
    Pages466-469
    Number of pages4
    Publication statusPublished - 2002
    EventEurosensors XVI, Praha, Czech Republik; - Praha, Czech Republik
    Duration: 15 Sep 200218 Sep 2002

    Publication series

    Name
    PublisherCzech Technical University

    Conference

    ConferenceEurosensors XVI, Praha, Czech Republik;
    Period15/09/0218/09/02

    Keywords

    • Conf.proc. > 3 pag

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