Mechanical reliability of micromachined silicon wafers with deep rectangular recesses and Via-Hole fences

A Poliakov, M Bartek, JN Burghartz

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Eurosensors XVI 16th European Conference on Solid-State Transducers
Editors	J Saneistr, P Ripka
Place of Publication	Praha, Czech Republik
Publisher	Czech Technical University
Pages	466-469
Number of pages	4
Publication status	Published - 2002
Event	Eurosensors XVI, Praha, Czech Republik; - Praha, Czech Republik Duration: 15 Sept 2002 → 18 Sept 2002

Name
Publisher	Czech Technical University

Conference	Eurosensors XVI, Praha, Czech Republik;
Period	15/09/02 → 18/09/02

Keywords

@inproceedings{f72555ca437d426ba99889f42dcf9437,

title = "Mechanical reliability of micromachined silicon wafers with deep rectangular recesses and Via-Hole fences",

keywords = "Conf.proc. > 3 pag",

author = "A Poliakov and M Bartek and JN Burghartz",

year = "2002",

language = "Undefined/Unknown",

publisher = "Czech Technical University",

pages = "466--469",

editor = "J Saneistr and P Ripka",

booktitle = "Eurosensors XVI 16th European Conference on Solid-State Transducers",

note = "Eurosensors XVI, Praha, Czech Republik; ; Conference date: 15-09-2002 Through 18-09-2002",

}

Mechanical reliability of micromachined silicon wafers with deep rectangular recesses and Via-Hole fences. / Poliakov, A; Bartek, M; Burghartz, JN.
Eurosensors XVI 16th European Conference on Solid-State Transducers. ed. / J Saneistr; P Ripka. Praha, Czech Republik: Czech Technical University, 2002. p. 466-469.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Mechanical reliability of micromachined silicon wafers with deep rectangular recesses and Via-Hole fences

AU - Poliakov, A

AU - Bartek, M

AU - Burghartz, JN

PY - 2002

Y1 - 2002

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 466

EP - 469

BT - Eurosensors XVI 16th European Conference on Solid-State Transducers

A2 - Saneistr, J

A2 - Ripka, P

PB - Czech Technical University

CY - Praha, Czech Republik

T2 - Eurosensors XVI, Praha, Czech Republik;

Y2 - 15 September 2002 through 18 September 2002

ER -