Mechanical reliability of silicon wafers with through-wafer vias for wafer-level packaging

A Poliakov, M Bartek, JN Burghartz

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	Undefined/Unknown
Pages (from-to)	1783-1788
Number of pages	6
Journal	Microelectronics Reliability
Volume	42
Publication status	Published - 2002

Keywords

@article{d85252b6a63d407d98c24b228b2c5443,

title = "Mechanical reliability of silicon wafers with through-wafer vias for wafer-level packaging",

keywords = "Elektrotechniek, Techniek, ZX CWTS JFIS < 1.00",

author = "A Poliakov and M Bartek and JN Burghartz",

year = "2002",

language = "Undefined/Unknown",

volume = "42",

pages = "1783--1788",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier",

}