Mechanical reliability of silicon wafers with through-wafer vias for wafer-level packaging

A Poliakov, M Bartek, JN Burghartz

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    8 Citations (Scopus)
    Original languageUndefined/Unknown
    Title of host publicationESREF 2002 Proceedings of the 13th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis
    EditorsF Fantini, M Vanzi
    Place of PublicationNew York
    PublisherElsevier
    Pages1-5
    Number of pages5
    ISBN (Print)0-08-044181-5
    Publication statusPublished - 2002
    EventESREF 2002, Rimini, Italy - New York
    Duration: 7 Oct 200211 Oct 2002

    Publication series

    Name
    PublisherElsevier Science

    Conference

    ConferenceESREF 2002, Rimini, Italy
    Period7/10/0211/10/02

    Keywords

    • Elektrotechniek
    • Techniek
    • Conf.proc. > 3 pag

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