@inproceedings{99402c88b02d4e26a0e8f7f87235d18f,
title = "Mechanical reliability of silicon wafers with through-wafer vias for wafer-level packaging",
keywords = "Elektrotechniek, Techniek, Conf.proc. > 3 pag",
author = "A Poliakov and M Bartek and JN Burghartz",
note = "CD-ROM; ESREF 2002, Rimini, Italy ; Conference date: 07-10-2002 Through 11-10-2002",
year = "2002",
language = "Undefined/Unknown",
isbn = "0-08-044181-5",
publisher = "Elsevier",
pages = "1--5",
editor = "F Fantini and M Vanzi",
booktitle = "ESREF 2002 Proceedings of the 13th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis",
}