Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

Henk van Zeijl, Y. Carisey, A. Damian, Rene Poelma, Zinn, A, Guo Qi Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

4 Citations (Scopus)

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Physics & Astronomy