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Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration
Henk van Zeijl, Y. Carisey, A. Damian, Rene Poelma, Zinn, A, Guo Qi Zhang
Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
7
Citations
(Scopus)