Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

Leiming Du; Dong Hu; René  Poelm; Willem van Driel; Kouchi Zhang

doi:10.1109/EuroSimE56861.2023.10100756

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

Leiming Du^*, Dong Hu, René Poelm, Willem van Driel, Kouchi Zhang

^*Corresponding author for this work

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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Abstract

The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However, there are only a few studies with regard to the mechanical properties of sintered Cu. As the die-attach layer undergoes thermal and mechanical stress during its application, it is essential to investigate the micro-scale mechanical properties of sintered Cu. Fracture toughness is a measure of the resistance of a material to crack propagation under predominantly linear-elastic conditions, which is an essential parameter for predicting fracture failure. As cracks and defects are difficult to avoid during fabrication and application processing for sintered Cu, which will definitely cause a significant effect on micromechanical properties. Thus, it is essential to reveal the effect of microstructure on fracture toughess of sintered Cu nanoparticles.

Original language	English
Title of host publication	Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Publisher	IEEE
Pages	1-4
Number of pages	4
ISBN (Electronic)	979-8-3503-4597-1
ISBN (Print)	979-8-3503-4598-8
DOIs	https://doi.org/10.1109/EuroSimE56861.2023.10100756
Publication status	Published - 2023
Event	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Graz, Austria Duration: 16 Apr 2023 → 19 Apr 2023 Conference number: 24th

Publication series

Name	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Conference

Conference	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Country/Territory	Austria
City	Graz
Period	16/04/23 → 19/04/23

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

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Micro-cantilever_Bending_Test_of_Sintered_Cu_nanoparticles_for_Power_Electronic_DevicesFinal published version, 520 KB

Cite this

Du, L., Hu, D., Poelm, R., van Driel, W., & Zhang, K. (2023). Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices. In Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (pp. 1-4). (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). IEEE. https://doi.org/10.1109/EuroSimE56861.2023.10100756

Du, Leiming ; Hu, Dong ; Poelm, René et al. / Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices. Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2023. pp. 1-4 (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

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abstract = "The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However, there are only a few studies with regard to the mechanical properties of sintered Cu. As the die-attach layer undergoes thermal and mechanical stress during its application, it is essential to investigate the micro-scale mechanical properties of sintered Cu. Fracture toughness is a measure of the resistance of a material to crack propagation under predominantly linear-elastic conditions, which is an essential parameter for predicting fracture failure. As cracks and defects are difficult to avoid during fabrication and application processing for sintered Cu, which will definitely cause a significant effect on micromechanical properties. Thus, it is essential to reveal the effect of microstructure on fracture toughess of sintered Cu nanoparticles.",

author = "Leiming Du and Dong Hu and Ren{\'e} Poelm and {van Driel}, Willem and Kouchi Zhang",

note = "Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.; 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ; Conference date: 16-04-2023 Through 19-04-2023",

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Du, L , Hu, D, Poelm, R, van Driel, W & Zhang, K 2023, Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices. in Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, IEEE, pp. 1-4, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz, Austria, 16/04/23. https://doi.org/10.1109/EuroSimE56861.2023.10100756

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices. / Du, Leiming ; Hu, Dong; Poelm, René et al.
Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2023. p. 1-4 (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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AU - Du, Leiming

AU - Hu, Dong

AU - Poelm, René

AU - van Driel, Willem

AU - Zhang, Kouchi

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PY - 2023

Y1 - 2023

N2 - The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However, there are only a few studies with regard to the mechanical properties of sintered Cu. As the die-attach layer undergoes thermal and mechanical stress during its application, it is essential to investigate the micro-scale mechanical properties of sintered Cu. Fracture toughness is a measure of the resistance of a material to crack propagation under predominantly linear-elastic conditions, which is an essential parameter for predicting fracture failure. As cracks and defects are difficult to avoid during fabrication and application processing for sintered Cu, which will definitely cause a significant effect on micromechanical properties. Thus, it is essential to reveal the effect of microstructure on fracture toughess of sintered Cu nanoparticles.

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Du L , Hu D, Poelm R, van Driel W , Zhang K. Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices. In Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE. 2023. p. 1-4. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). doi: 10.1109/EuroSimE56861.2023.10100756

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

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