Micromachining for Advanced Terahertz: Interconnects and Packaging Techniques at Terahertz Frequencies

Maria Alonso-Del Pino; Cecile Jung-Kubiak; Theodore Reck; Choonsup Lee; Goutam Chattopadhyay

doi:10.1109/MMM.2019.2945157

Micromachining for Advanced Terahertz: Interconnects and Packaging Techniques at Terahertz Frequencies

Maria Alonso-Del Pino, Cecile Jung-Kubiak, Theodore Reck, Choonsup Lee, Goutam Chattopadhyay

Tera-Hertz Sensing

Research output: Contribution to journal › Article › Scientific › peer-review

4 Citations (Scopus)

Abstract

It is difficult to package and interconnect components and devices at millimeter-waves (mm-waves) due to excessive losses experiences at these frequencies using traditional techniques. The problem is multiplied manifold at terahertz (THz) frequencies. In this article, we review the current state of THz packaging and describe several novel techniques. As we will show, micromachined packaging is emerging as one of the best choices for developing advanced THz systems.

Original language	English
Article number	8913695
Pages (from-to)	18-34
Number of pages	17
Journal	IEEE Microwave Magazine
Volume	21
Issue number	1
DOIs	https://doi.org/10.1109/MMM.2019.2945157
Publication status	Published - Jan 2020

Access to Document

10.1109/MMM.2019.2945157

Link to publication in Scopus

Fingerprint Dive into the research topics of 'Micromachining for Advanced Terahertz: Interconnects and Packaging Techniques at Terahertz Frequencies'. Together they form a unique fingerprint.

Cite this

@article{d4c331a8714749239a7ea372282cbcaa,

title = "Micromachining for Advanced Terahertz: Interconnects and Packaging Techniques at Terahertz Frequencies",

abstract = "It is difficult to package and interconnect components and devices at millimeter-waves (mm-waves) due to excessive losses experiences at these frequencies using traditional techniques. The problem is multiplied manifold at terahertz (THz) frequencies. In this article, we review the current state of THz packaging and describe several novel techniques. As we will show, micromachined packaging is emerging as one of the best choices for developing advanced THz systems.",

author = "{Alonso-Del Pino}, Maria and Cecile Jung-Kubiak and Theodore Reck and Choonsup Lee and Goutam Chattopadhyay",

year = "2020",

month = jan,

doi = "10.1109/MMM.2019.2945157",

language = "English",

volume = "21",

pages = "18--34",

journal = "IEEE Microwave Magazine",

issn = "1527-3342",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

number = "1",

}

TY - JOUR

T1 - Micromachining for Advanced Terahertz

T2 - Interconnects and Packaging Techniques at Terahertz Frequencies

AU - Alonso-Del Pino, Maria

AU - Jung-Kubiak, Cecile

AU - Reck, Theodore

AU - Lee, Choonsup

AU - Chattopadhyay, Goutam

PY - 2020/1

Y1 - 2020/1

N2 - It is difficult to package and interconnect components and devices at millimeter-waves (mm-waves) due to excessive losses experiences at these frequencies using traditional techniques. The problem is multiplied manifold at terahertz (THz) frequencies. In this article, we review the current state of THz packaging and describe several novel techniques. As we will show, micromachined packaging is emerging as one of the best choices for developing advanced THz systems.

AB - It is difficult to package and interconnect components and devices at millimeter-waves (mm-waves) due to excessive losses experiences at these frequencies using traditional techniques. The problem is multiplied manifold at terahertz (THz) frequencies. In this article, we review the current state of THz packaging and describe several novel techniques. As we will show, micromachined packaging is emerging as one of the best choices for developing advanced THz systems.

UR - http://www.scopus.com/inward/record.url?scp=85076109589&partnerID=8YFLogxK

U2 - 10.1109/MMM.2019.2945157

DO - 10.1109/MMM.2019.2945157

M3 - Article

AN - SCOPUS:85076109589

VL - 21

SP - 18

EP - 34

JO - IEEE Microwave Magazine

JF - IEEE Microwave Magazine

SN - 1527-3342

IS - 1

M1 - 8913695

ER -