Micromachining for Advanced Terahertz: Interconnects and Packaging Techniques at Terahertz Frequencies

Maria Alonso-Del Pino, Cecile Jung-Kubiak, Theodore Reck, Choonsup Lee, Goutam Chattopadhyay

Research output: Contribution to journalArticleScientificpeer-review

4 Citations (Scopus)

Abstract

It is difficult to package and interconnect components and devices at millimeter-waves (mm-waves) due to excessive losses experiences at these frequencies using traditional techniques. The problem is multiplied manifold at terahertz (THz) frequencies. In this article, we review the current state of THz packaging and describe several novel techniques. As we will show, micromachined packaging is emerging as one of the best choices for developing advanced THz systems.

Original languageEnglish
Article number8913695
Pages (from-to)18-34
Number of pages17
JournalIEEE Microwave Magazine
Volume21
Issue number1
DOIs
Publication statusPublished - Jan 2020

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