Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

D Yang, KMB Jansen, L WANG, LJ Ernst, GQ Zhang, HJL Bressers, X Fan

Research output: Contribution to journalArticleScientificpeer-review

21 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)676-683
Number of pages8
JournalIEEE Transactions on Components and Packaging Technology
Issue number4
Publication statusPublished - 2004


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