Microstructure evolution and shear behavior of the solder joints for flip-chip LED on ENIG substrate

Y Liu, F Sun, L Luo, CA Yuan, GQ Zhang

Research output: Contribution to journal › Article › Scientific › peer-review

14 Citations (Scopus)

Original language	English
Pages (from-to)	2450-2457
Number of pages	8
Journal	Journal of Electronic Materials
Volume	44
Issue number	7
DOIs	https://doi.org/10.1007/s11664-015-3774-9
Publication status	Published - 2015

Harvest
First online 18-4-2015

Access to Document

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title = "Microstructure evolution and shear behavior of the solder joints for flip-chip LED on ENIG substrate",

author = "Y Liu and F Sun and L Luo and CA Yuan and GQ Zhang",

note = "Harvest First online 18-4-2015",

year = "2015",

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language = "English",

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journal = "Journal of Electronic Materials",

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T1 - Microstructure evolution and shear behavior of the solder joints for flip-chip LED on ENIG substrate

AU - Liu, Y

AU - Sun, F

AU - Luo, L

AU - Yuan, CA

AU - Zhang, GQ

N1 - Harvest First online 18-4-2015

PY - 2015

Y1 - 2015

U2 - 10.1007/s11664-015-3774-9

DO - 10.1007/s11664-015-3774-9

M3 - Article

SN - 0361-5235

VL - 44

SP - 2450

EP - 2457

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 7

ER -