Microstructure evolution and shear behavior of the solder joints for flip-chip LED on ENIG substrate

Y Liu, F Sun, L Luo, CA Yuan, GQ Zhang

Research output: Contribution to journalArticleScientificpeer-review

12 Citations (Scopus)
Original languageEnglish
Pages (from-to)2450-2457
Number of pages8
JournalJournal of Electronic Materials
Volume44
Issue number7
DOIs
Publication statusPublished - 2015

Bibliographical note

Harvest
First online 18-4-2015

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