Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages

J Tang, CH Chen, SK Liang, EGJ Reinders, CTA Revenberg, JBJ Schelen, CIM Beenakker

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings 63rd Electronic Components and Technology Conference (ECTC 2013)
EditorsW Sauter
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages1717-1723
Number of pages7
ISBN (Print)978-1-4799-0233-0
DOIs
Publication statusPublished - 2013
EventECTC 2013, Las Vegas, Nevada - Piscataway
Duration: 28 May 201331 May 2013

Publication series

Name
PublisherIEEE

Conference

ConferenceECTC 2013, Las Vegas, Nevada
Period28/05/1331/05/13

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