Currently, prediction of interface strength is typically done using the critical energy release rate. Interface strength, however, is heavily dependent on mode mixity. Accurately predicting delamination therefore requires a material model that includes the mode dependency of interface strength. A novel test setup is designed which allows mixed mode delamination testing. The setup is a stabilized version of the mixed mode bending test previously described by Reeder and Crews [5.6]. It allows for the measurement of stable crack growth over the full range of mode mixities, using a single specimen design. The crack length, necessary for calculation of the energy release rate, is obtained from an analytical model. Crack length and displacement data are used in a finite element model containing a crack tip to calculate the mode mixity.
|Title of host publication||Proceedings 56th Electronic Components & Technology Conference 2006|
|Place of Publication||San Diego, CA, USA|
|Number of pages||5|
|Publication status||Published - 2006|
|Event||56th Electronic Components & Technology Conference - San Diego, CA, USA|
Duration: 30 May 2006 → 2 Jun 2006
|Conference||56th Electronic Components & Technology Conference|
|Period||30/05/06 → 2/06/06|
- conference contrib. refereed
- Conf.proc. > 3 pag
Thijsse, J., van Driel, WD., van Gils, MAJ., & van der Sluis, O. (2006). Mixed Mode Bending Test for Interfacial Adhesion in Semiconductor Applications. In IEEE/ECTC (Ed.), Proceedings 56th Electronic Components & Technology Conference 2006 (pp. 1-5). IEEE Society.