Mixed Mode Bending Test for Interfacial Adhesion in Semiconductor Applications

J. Thijsse; WD van Driel; MAJ van Gils; O van der Sluis

Mixed Mode Bending Test for Interfacial Adhesion in Semiconductor Applications

J. Thijsse, WD van Driel, MAJ van Gils, O van der Sluis

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Abstract

Currently, prediction of interface strength is typically done using the critical energy release rate. Interface strength, however, is heavily dependent on mode mixity. Accurately predicting delamination therefore requires a material model that includes the mode dependency of interface strength. A novel test setup is designed which allows mixed mode delamination testing. The setup is a stabilized version of the mixed mode bending test previously described by Reeder and Crews [5.6]. It allows for the measurement of stable crack growth over the full range of mode mixities, using a single specimen design. The crack length, necessary for calculation of the energy release rate, is obtained from an analytical model. Crack length and displacement data are used in a finite element model containing a crack tip to calculate the mode mixity.

Original language	Undefined/Unknown
Title of host publication	Proceedings 56th Electronic Components & Technology Conference 2006
Editors	IEEE/ECTC
Place of Publication	San Diego, CA, USA
Publisher	IEEE Society
Pages	1-5
Number of pages	5
ISBN (Print)	1-4244-0152-6
Publication status	Published - 2006
Event	56th Electronic Components & Technology Conference - San Diego, CA, USA Duration: 30 May 2006 → 2 Jun 2006

Publication series

Name
Publisher	IEEE

Conference

Conference	56th Electronic Components & Technology Conference
Period	30/05/06 → 2/06/06

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{70bee5d0ab5a4e47b19a8a9ad2edc296,

title = "Mixed Mode Bending Test for Interfacial Adhesion in Semiconductor Applications",

abstract = "Currently, prediction of interface strength is typically done using the critical energy release rate. Interface strength, however, is heavily dependent on mode mixity. Accurately predicting delamination therefore requires a material model that includes the mode dependency of interface strength. A novel test setup is designed which allows mixed mode delamination testing. The setup is a stabilized version of the mixed mode bending test previously described by Reeder and Crews [5.6]. It allows for the measurement of stable crack growth over the full range of mode mixities, using a single specimen design. The crack length, necessary for calculation of the energy release rate, is obtained from an analytical model. Crack length and displacement data are used in a finite element model containing a crack tip to calculate the mode mixity.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "J. Thijsse and {van Driel}, WD and {van Gils}, MAJ and {van der Sluis}, O",

year = "2006",

language = "Undefined/Unknown",

isbn = "1-4244-0152-6",

publisher = "IEEE Society",

pages = "1--5",

editor = "IEEE/ECTC",

booktitle = "Proceedings 56th Electronic Components & Technology Conference 2006",

note = "56th Electronic Components & Technology Conference ; Conference date: 30-05-2006 Through 02-06-2006",

}

Mixed Mode Bending Test for Interfacial Adhesion in Semiconductor Applications. / Thijsse, J.; van Driel, WD; van Gils, MAJ et al.
Proceedings 56th Electronic Components & Technology Conference 2006. ed. / IEEE/ECTC. San Diego, CA, USA: IEEE Society, 2006. p. 1-5.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Mixed Mode Bending Test for Interfacial Adhesion in Semiconductor Applications

AU - Thijsse, J.

AU - van Driel, WD

AU - van Gils, MAJ

AU - van der Sluis, O

PY - 2006

Y1 - 2006

N2 - Currently, prediction of interface strength is typically done using the critical energy release rate. Interface strength, however, is heavily dependent on mode mixity. Accurately predicting delamination therefore requires a material model that includes the mode dependency of interface strength. A novel test setup is designed which allows mixed mode delamination testing. The setup is a stabilized version of the mixed mode bending test previously described by Reeder and Crews [5.6]. It allows for the measurement of stable crack growth over the full range of mode mixities, using a single specimen design. The crack length, necessary for calculation of the energy release rate, is obtained from an analytical model. Crack length and displacement data are used in a finite element model containing a crack tip to calculate the mode mixity.

AB - Currently, prediction of interface strength is typically done using the critical energy release rate. Interface strength, however, is heavily dependent on mode mixity. Accurately predicting delamination therefore requires a material model that includes the mode dependency of interface strength. A novel test setup is designed which allows mixed mode delamination testing. The setup is a stabilized version of the mixed mode bending test previously described by Reeder and Crews [5.6]. It allows for the measurement of stable crack growth over the full range of mode mixities, using a single specimen design. The crack length, necessary for calculation of the energy release rate, is obtained from an analytical model. Crack length and displacement data are used in a finite element model containing a crack tip to calculate the mode mixity.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 1-4244-0152-6

SP - 1

EP - 5

BT - Proceedings 56th Electronic Components & Technology Conference 2006

A2 - IEEE/ECTC, null

PB - IEEE Society

CY - San Diego, CA, USA

T2 - 56th Electronic Components & Technology Conference

Y2 - 30 May 2006 through 2 June 2006

ER -