@inproceedings{4541785704bb4a01a53ef778b541163c,
title = "Mixed mode interface characerization considering thermal redisidual stress",
keywords = "Conf.proc. > 3 pag",
author = "A Xiao and G Schlottig and B Wunderle and KMB Jansen and LJ Ernst",
year = "2008",
language = "Undefined/Unknown",
isbn = "978-1-4244-2740-6",
publisher = "IEEE",
pages = "1--8",
editor = "K Bi and F Xiao",
booktitle = "Proceedings 2008 International conference on electronic packaging technology & high density packaging",
address = "United States",
}