Mixed mode interface characerization considering thermal redisidual stress

A Xiao, G Schlottig, B Wunderle, KMB Jansen, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationProceedings 2008 International conference on electronic packaging technology & high density packaging
EditorsK Bi, F Xiao
PublisherIEEE
Pages1-8
Number of pages8
ISBN (Print)978-1-4244-2740-6
Publication statusPublished - 2008

Publication series

Name
PublisherIEEE

Keywords

  • Conf.proc. > 3 pag

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