Mode I toughening of bio-based epoxy adhesive through 3D-printed biomimetic reinforcements

Bio-based epoxy adhesives face significant challenges due to their relatively poor mechanical properties compared to their petroleum-based competitors, including low fracture toughness and abrupt failure. By mimicking the molecular structure of spider silk, which is one of the toughest materials in nature, 3D-printed polymer overlapping curls consisting of coiling fibers with sacrificial bonds and hidden lengths, were impregnated into a bio-based epoxy adhesive to improve its mode I fracture toughness. Such bio-inspired structures were designed specifically to toughen and improve the crack resistance of adhesive joints. These overlapping curls were embedded in the bio-based epoxy bondline with various adhesion patterning strategies, aiming to architect the fracture scenario and increase mode I energy dissipation. Double cantilever beam test results show that an extrinsic bridging is triggered by the embedded curls that promote progressive failure and delay crack growth, which improved the mean energy release rate by 133% and enhanced the mean peak energy release rate up to 313%. The proposed 3D-printed coiling fibers successfully improved the mechanical performance of the bio-based epoxy and retarded the crack growth within the bondline, opening new horizons for their use as carriers of bondlines in structural applications to control crack growth in adhesively bonded joints.