Modeling and characterization of molding compound properties during cure

KMB Jansen, C Qian, LJ Ernst, C Bohm, A Kessler, H Preu, M Stecher

Research output: Contribution to journalArticleScientificpeer-review

14 Citations (Scopus)


During the encapsulation of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die.
Original languageUndefined/Unknown
Pages (from-to)872-876
Number of pages5
JournalMicroelectronics Reliability
Issue number2009
Publication statusPublished - 2009


  • academic journal papers
  • CWTS JFIS < 0.75

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