Modeling and characterization of molding compound properties during cure

KMB Jansen, C Qian, LJ Ernst, C Bohm, A Kessler, H Preu, M Stecher

Research output: Contribution to journalArticleScientificpeer-review

14 Citations (Scopus)

Abstract

During the encapsulation of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die.
Original languageUndefined/Unknown
Pages (from-to)872-876
Number of pages5
JournalMicroelectronics Reliability
Volume49
Issue number2009
Publication statusPublished - 2009

Keywords

  • academic journal papers
  • CWTS JFIS < 0.75

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