Modeling and compensation of packaging asymmetry in a 2-D wind sensor

SP Matova; KAA Makinwa; JH Huijsing

Modeling and compensation of packaging asymmetry in a 2-D wind sensor

Electronic Instrumentation

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Collection of papers presented at the international workshop on THERMal INvestigation of ICs and systems; plus a special half-day on reliability
Place of Publication	Madrid
Publisher	s.n.
Pages	70-73
Number of pages	4
ISBN (Print)	2-913329-97-7
Publication status	Published - 2002
Event	International workshop on THERMal Investigation of ICs and systems - Madrid Duration: 1 Oct 2002 → 4 Oct 2002

Publication series

Name
Publisher	s.n.

Name
Volume	70

Conference

Conference	International workshop on THERMal Investigation of ICs and systems
Period	1/10/02 → 4/10/02

Keywords

Elektrotechniek
Techniek
Conf.proc. > 3 pag

Cite this

@inproceedings{5fb60092c094426aa9c770e63565522c,

title = "Modeling and compensation of packaging asymmetry in a 2-D wind sensor",

keywords = "Elektrotechniek, Techniek, Conf.proc. > 3 pag",

author = "SP Matova and KAA Makinwa and JH Huijsing",

year = "2002",

language = "Undefined/Unknown",

isbn = "2-913329-97-7",

publisher = "s.n.",

pages = "70--73",

booktitle = "Collection of papers presented at the international workshop on THERMal INvestigation of ICs and systems; plus a special half-day on reliability",

note = "International workshop on THERMal Investigation of ICs and systems ; Conference date: 01-10-2002 Through 04-10-2002",

}

Modeling and compensation of packaging asymmetry in a 2-D wind sensor. / Matova, SP; Makinwa, KAA ; Huijsing, JH.
Collection of papers presented at the international workshop on THERMal INvestigation of ICs and systems; plus a special half-day on reliability. Madrid: s.n., 2002. p. 70-73.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Modeling and compensation of packaging asymmetry in a 2-D wind sensor

AU - Matova, SP

AU - Makinwa, KAA

AU - Huijsing, JH

PY - 2002

Y1 - 2002

KW - Elektrotechniek

KW - Techniek

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 2-913329-97-7

SP - 70

EP - 73

BT - Collection of papers presented at the international workshop on THERMal INvestigation of ICs and systems; plus a special half-day on reliability

PB - s.n.

CY - Madrid

T2 - International workshop on THERMal Investigation of ICs and systems

Y2 - 1 October 2002 through 4 October 2002

ER -