Modeling lead free solder reliability in SSL applications towards virtual design

R Kregting, M Erinc, J Kloosterman, WD van Driel

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012
Place of Publications.l.
PublisherIEEE Society
Pages1-6
Number of pages6
DOIs
Publication statusPublished - 2012
EventEuroSimE 2012: 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Lisbon, Portugal
Duration: 16 Apr 201218 Apr 2012
Conference number: 13

Conference

ConferenceEuroSimE 2012
CountryPortugal
CityLisbon
Period16/04/1218/04/12

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