Modeling of the mechanical stiffness of the GaP/GaAs nanowires with point defects/stacking faults

AW Dawotola, CA Yuan, WD van Driel, GQ Zhang, EPAM Bakkers

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

The semiconductor type III-V nanowires (e.g., GaAs, GaP, InAs, InP, etc.) has excellent electronic/optical properties for the application of next-generation nano-scaled transistor, light-emitting diode and bio/chemical sensors. However, the electronic conductance of the nanowire is highly sensitive to the internal stress/strain condition under external loadings. In this paper, the mechanical stiffness of the GaAs and GaP nanowires are simulated, and the trend of the results are validated by the bulk experiments. The mechanical influence of the point defect and the stacking faults are considered. Moreover, an analytical solution is established to describe the mechanical stiffness decreasing of the stacking faults. The simulations indicate that the mechanical stiffness of the nanowire is influenced by the density of the stacking faults and the density of covalent bonds at the twin-dislocation interface. Key Words: III-V nano-scaled semiconductors, Molecular dynamics calculations, Stacking faults, Mechanical properties.
Original languageUndefined/Unknown
Title of host publicationProceedings 7th International Conference on Electronics Packaging Technology (ICEPT 2007)
EditorsS Liu, Keyun Bi
Place of PublicationShanghai, China
PublisherIEEE Society
Pages1-5
Number of pages5
ISBN (Print)onbekend
Publication statusPublished - 2007
Event7th International Conference on Electronics Packaging Technology (ICEPT 2007) - Shanghai, China
Duration: 14 Aug 200717 Aug 2007

Publication series

Name
PublisherIEEE

Conference

Conference7th International Conference on Electronics Packaging Technology (ICEPT 2007)
Period14/08/0717/08/07

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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