Modelling of the Kinetics in Copper Chemical Vapour Deposition from Cu(hfac)VTMS

MLH ter Heerdt, JJ Overdijk, PJ van der Put, J Schoonman

Research output: Contribution to journal › Article › Scientific › peer-review

Cite this

@article{bbd4cf1160f74a07948ddc903106380f,

title = "Modelling of the Kinetics in Copper Chemical Vapour Deposition from Cu(hfac)VTMS",

author = "{ter Heerdt}, MLH and JJ Overdijk and {van der Put}, PJ and J Schoonman",

year = "1999",

language = "Undefined/Unknown",

volume = "11",

pages = "3470--3475",

journal = "Chemistry of Materials",

issn = "0897-4756",

publisher = "American Chemical Society (ACS)",

}