Modelling the thermal conductivity of epoxy nanocomposites with low filler concentrations

IA Tsekmes; PHF Morshuis; R Kochetov; JJ Smit

doi:10.1109/CEIDP.2013.6748211

Modelling the thermal conductivity of epoxy nanocomposites with low filler concentrations

IA Tsekmes, PHF Morshuis, R Kochetov, JJ Smit

Intelligent Electrical Power Grids

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

4 Citations (Scopus)

Original language	English
Title of host publication	Proceedings of the 2013 IEEE Conference on Electrical Insulation and Dielectric Phenomena
Editors	M Abou-Dakka, et al
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE
Pages	699-702
Number of pages	4
ISBN (Print)	978-1-4799-2597-1
DOIs	https://doi.org/10.1109/CEIDP.2013.6748211
Publication status	Published - 2013
Event	IEEE-CEIDP 2013, Shenzhen, China - Piscataway, NJ, USA Duration: 20 Oct 2013 → 23 Oct 2013

Publication series

Name
Publisher	IEEE

Conference

Conference	IEEE-CEIDP 2013, Shenzhen, China
Period	20/10/13 → 23/10/13

Access to Document

10.1109/CEIDP.2013.6748211

Cite this

@inproceedings{5e4b7ef010694fb7b383adfa184617f4,

title = "Modelling the thermal conductivity of epoxy nanocomposites with low filler concentrations",

author = "IA Tsekmes and PHF Morshuis and R Kochetov and JJ Smit",

year = "2013",

doi = "10.1109/CEIDP.2013.6748211",

language = "English",

isbn = "978-1-4799-2597-1",

publisher = "IEEE",

pages = "699--702",

editor = "M Abou-Dakka and {et al}",

booktitle = "Proceedings of the 2013 IEEE Conference on Electrical Insulation and Dielectric Phenomena",

address = "United States",

note = "IEEE-CEIDP 2013, Shenzhen, China ; Conference date: 20-10-2013 Through 23-10-2013",

}

Tsekmes, IA, Morshuis, PHF, Kochetov, R & Smit, JJ 2013, Modelling the thermal conductivity of epoxy nanocomposites with low filler concentrations. in M Abou-Dakka & et al (eds), Proceedings of the 2013 IEEE Conference on Electrical Insulation and Dielectric Phenomena. IEEE, Piscataway, NJ, USA, pp. 699-702, IEEE-CEIDP 2013, Shenzhen, China, 20/10/13. https://doi.org/10.1109/CEIDP.2013.6748211

Modelling the thermal conductivity of epoxy nanocomposites with low filler concentrations. / Tsekmes, IA; Morshuis, PHF; Kochetov, R et al.
Proceedings of the 2013 IEEE Conference on Electrical Insulation and Dielectric Phenomena. ed. / M Abou-Dakka; et al. Piscataway, NJ, USA: IEEE, 2013. p. 699-702.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Modelling the thermal conductivity of epoxy nanocomposites with low filler concentrations

AU - Tsekmes, IA

AU - Morshuis, PHF

AU - Kochetov, R

AU - Smit, JJ

PY - 2013

Y1 - 2013

U2 - 10.1109/CEIDP.2013.6748211

DO - 10.1109/CEIDP.2013.6748211

M3 - Conference contribution

SN - 978-1-4799-2597-1

SP - 699

EP - 702

BT - Proceedings of the 2013 IEEE Conference on Electrical Insulation and Dielectric Phenomena

A2 - Abou-Dakka, M

A2 - et al, null

PB - IEEE

CY - Piscataway, NJ, USA

T2 - IEEE-CEIDP 2013, Shenzhen, China

Y2 - 20 October 2013 through 23 October 2013

ER -