Modelling the thermal conductivity of epoxy nanocomposites with low filler concentrations

IA Tsekmes, PHF Morshuis, R Kochetov, JJ Smit

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

4 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings of the 2013 IEEE Conference on Electrical Insulation and Dielectric Phenomena
EditorsM Abou-Dakka, et al
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages699-702
Number of pages4
ISBN (Print)978-1-4799-2597-1
DOIs
Publication statusPublished - 2013
EventIEEE-CEIDP 2013, Shenzhen, China - Piscataway, NJ, USA
Duration: 20 Oct 201323 Oct 2013

Publication series

Name
PublisherIEEE

Conference

ConferenceIEEE-CEIDP 2013, Shenzhen, China
Period20/10/1323/10/13

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