Molecular design of reliable epoxy-copper interface using Molecular Dynamic Simulation

KY Wong; HB Fan; GQ Zhang; MF Yuen

Molecular design of reliable epoxy-copper interface using Molecular Dynamic Simulation

KY Wong, HB Fan, GQ Zhang, MF Yuen

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

Abstract

Despite the fact that epoxy is continuously used as encapsulant in electronic packaging, its joint with copper-based substrate is prone to delaminate during reliability test. A prime reason is the lack of adhesion between Cu and epoxy compound. To solve the problem, self-assembly molecular structure (SAM) is adopted to improve adhesion of epoxy-copper system. In seeing that hydrophobic behaviour of the SAM structure may hinder moisture diffusion along the interface, further work in terms of the molecular structure of the SAM candidates is conducted in this study. This work aims at investigating the moisture effect on the interfacial adhesion with different types of SAM modified interfaces through molecular dynamic (MD) simulations. This study uses MD model as a tool to 1) predict the interfacial adhesion of the SAM modified interface in moisture sensitive condition; 2) investigate the moisture diffusion behavior of the modified interfaces under moisture sensitive conditions. The results demonstrate a reasonable qualitative co-relation between the MD prediction and the TDCB tested data. Nevertheless, without the experimental adsorption data for the SAM material, the moisture diffusion coefficient obtained from MD study cannot explain the adhesion degradation after aging.

Original language	English
Title of host publication	Proceedings of 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, Bordeaux, France, April 26-27-28-2010
Editors	Ernst, LJ, Driel, WD van, Zhang, GQ, Rodgers, P, Bailey, C, Saint Leger, O de
Place of Publication	Bordeaux, France
Publisher	IEEE Society
Pages	1-7
Number of pages	7
ISBN (Print)	978-1-4244-7025-9
Publication status	Published - 2010
Event	EuroSimE 2010 : 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems - Bordeaux, Frankrijk, Bordeaux, France Duration: 25 Apr 2010 → 28 Apr 2010 Conference number: 11

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2010
Country/Territory	France
City	Bordeaux
Period	25/04/10 → 28/04/10

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Wong, KY., Fan, HB., Zhang, GQ., & Yuen, MF. (2010). Molecular design of reliable epoxy-copper interface using Molecular Dynamic Simulation. In Ernst, LJ, Driel, WD van, Zhang, GQ, Rodgers, P, Bailey, C, & Saint Leger, O de (Eds.), Proceedings of 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, Bordeaux, France, April 26-27-28-2010 (pp. 1-7). IEEE Society.

Wong, KY ; Fan, HB ; Zhang, GQ ; Yuen, MF. / Molecular design of reliable epoxy-copper interface using Molecular Dynamic Simulation. Proceedings of 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, Bordeaux, France, April 26-27-28-2010. editor / Ernst, LJ ; Driel, WD van ; Zhang, GQ ; Rodgers, P ; Bailey, C ; Saint Leger, O de. Bordeaux, France : IEEE Society, 2010. pp. 1-7

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title = "Molecular design of reliable epoxy-copper interface using Molecular Dynamic Simulation",

abstract = "Despite the fact that epoxy is continuously used as encapsulant in electronic packaging, its joint with copper-based substrate is prone to delaminate during reliability test. A prime reason is the lack of adhesion between Cu and epoxy compound. To solve the problem, self-assembly molecular structure (SAM) is adopted to improve adhesion of epoxy-copper system. In seeing that hydrophobic behaviour of the SAM structure may hinder moisture diffusion along the interface, further work in terms of the molecular structure of the SAM candidates is conducted in this study. This work aims at investigating the moisture effect on the interfacial adhesion with different types of SAM modified interfaces through molecular dynamic (MD) simulations. This study uses MD model as a tool to 1) predict the interfacial adhesion of the SAM modified interface in moisture sensitive condition; 2) investigate the moisture diffusion behavior of the modified interfaces under moisture sensitive conditions. The results demonstrate a reasonable qualitative co-relation between the MD prediction and the TDCB tested data. Nevertheless, without the experimental adsorption data for the SAM material, the moisture diffusion coefficient obtained from MD study cannot explain the adhesion degradation after aging.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "KY Wong and HB Fan and GQ Zhang and MF Yuen",

year = "2010",

language = "English",

isbn = "978-1-4244-7025-9",

publisher = "IEEE Society",

pages = "1--7",

editor = "{Ernst, LJ} and {Driel, WD van} and {Zhang, GQ} and {Rodgers, P} and {Bailey, C} and {Saint Leger, O de}",

booktitle = "Proceedings of 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, Bordeaux, France, April 26-27-28-2010",

note = "EuroSimE 2010 : 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems ; Conference date: 25-04-2010 Through 28-04-2010",

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Wong, KY, Fan, HB, Zhang, GQ & Yuen, MF 2010, Molecular design of reliable epoxy-copper interface using Molecular Dynamic Simulation. in Ernst, LJ, Driel, WD van, Zhang, GQ, Rodgers, P, Bailey, C & Saint Leger, O de (eds), Proceedings of 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, Bordeaux, France, April 26-27-28-2010. IEEE Society, Bordeaux, France, pp. 1-7, EuroSimE 2010 , Bordeaux, France, 25/04/10.

Molecular design of reliable epoxy-copper interface using Molecular Dynamic Simulation. / Wong, KY; Fan, HB; Zhang, GQ; Yuen, MF.

Proceedings of 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, Bordeaux, France, April 26-27-28-2010. ed. / Ernst, LJ; Driel, WD van; Zhang, GQ; Rodgers, P; Bailey, C; Saint Leger, O de. Bordeaux, France : IEEE Society, 2010. p. 1-7.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Molecular design of reliable epoxy-copper interface using Molecular Dynamic Simulation

AU - Wong, KY

AU - Fan, HB

AU - Zhang, GQ

AU - Yuen, MF

N1 - Conference code: 11

PY - 2010

Y1 - 2010

N2 - Despite the fact that epoxy is continuously used as encapsulant in electronic packaging, its joint with copper-based substrate is prone to delaminate during reliability test. A prime reason is the lack of adhesion between Cu and epoxy compound. To solve the problem, self-assembly molecular structure (SAM) is adopted to improve adhesion of epoxy-copper system. In seeing that hydrophobic behaviour of the SAM structure may hinder moisture diffusion along the interface, further work in terms of the molecular structure of the SAM candidates is conducted in this study. This work aims at investigating the moisture effect on the interfacial adhesion with different types of SAM modified interfaces through molecular dynamic (MD) simulations. This study uses MD model as a tool to 1) predict the interfacial adhesion of the SAM modified interface in moisture sensitive condition; 2) investigate the moisture diffusion behavior of the modified interfaces under moisture sensitive conditions. The results demonstrate a reasonable qualitative co-relation between the MD prediction and the TDCB tested data. Nevertheless, without the experimental adsorption data for the SAM material, the moisture diffusion coefficient obtained from MD study cannot explain the adhesion degradation after aging.

AB - Despite the fact that epoxy is continuously used as encapsulant in electronic packaging, its joint with copper-based substrate is prone to delaminate during reliability test. A prime reason is the lack of adhesion between Cu and epoxy compound. To solve the problem, self-assembly molecular structure (SAM) is adopted to improve adhesion of epoxy-copper system. In seeing that hydrophobic behaviour of the SAM structure may hinder moisture diffusion along the interface, further work in terms of the molecular structure of the SAM candidates is conducted in this study. This work aims at investigating the moisture effect on the interfacial adhesion with different types of SAM modified interfaces through molecular dynamic (MD) simulations. This study uses MD model as a tool to 1) predict the interfacial adhesion of the SAM modified interface in moisture sensitive condition; 2) investigate the moisture diffusion behavior of the modified interfaces under moisture sensitive conditions. The results demonstrate a reasonable qualitative co-relation between the MD prediction and the TDCB tested data. Nevertheless, without the experimental adsorption data for the SAM material, the moisture diffusion coefficient obtained from MD study cannot explain the adhesion degradation after aging.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-7025-9

SP - 1

EP - 7

BT - Proceedings of 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, Bordeaux, France, April 26-27-28-2010

A2 - Ernst, LJ, null

A2 - Driel, WD van, null

A2 - Zhang, GQ, null

A2 - Rodgers, P, null

A2 - Bailey, C, null

A2 - Saint Leger, O de, null

PB - IEEE Society

CY - Bordeaux, France

T2 - EuroSimE 2010

Y2 - 25 April 2010 through 28 April 2010

ER -

Wong KY, Fan HB, Zhang GQ, Yuen MF. Molecular design of reliable epoxy-copper interface using Molecular Dynamic Simulation. In Ernst, LJ, Driel, WD van, Zhang, GQ, Rodgers, P, Bailey, C, Saint Leger, O de, editors, Proceedings of 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, Bordeaux, France, April 26-27-28-2010. Bordeaux, France: IEEE Society. 2010. p. 1-7

Molecular design of reliable epoxy-copper interface using Molecular Dynamic Simulation

Abstract

Publication series

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Keywords

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