Despite the fact that epoxy is continuously used as encapsulant in electronic packaging, its joint with copper-based substrate is prone to delaminate during reliability test. A prime reason is the lack of adhesion between Cu and epoxy compound. To solve the problem, self-assembly molecular structure (SAM) is adopted to improve adhesion of epoxy-copper system. In seeing that hydrophobic behaviour of the SAM structure may hinder moisture diffusion along the interface, further work in terms of the molecular structure of the SAM candidates is conducted in this study. This work aims at investigating the moisture effect on the interfacial adhesion with different types of SAM modified interfaces through molecular dynamic (MD) simulations. This study uses MD model as a tool to 1) predict the interfacial adhesion of the SAM modified interface in moisture sensitive condition; 2) investigate the moisture diffusion behavior of the modified interfaces under moisture sensitive conditions. The results demonstrate a reasonable qualitative co-relation between the MD prediction and the TDCB tested data. Nevertheless, without the experimental adsorption data for the SAM material, the moisture diffusion coefficient obtained from MD study cannot explain the adhesion degradation after aging.
|Title of host publication||Proceedings of 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, Bordeaux, France, April 26-27-28-2010|
|Editors||Ernst, LJ, Driel, WD van, Zhang, GQ, Rodgers, P, Bailey, C, Saint Leger, O de|
|Place of Publication||Bordeaux, France|
|Number of pages||7|
|Publication status||Published - 2010|
|Event||EuroSimE 2010 : 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems - Bordeaux, Frankrijk, Bordeaux, France|
Duration: 25 Apr 2010 → 28 Apr 2010
Conference number: 11
|Period||25/04/10 → 28/04/10|
- conference contrib. refereed
- Conf.proc. > 3 pag
Wong, KY., Fan, HB., Zhang, GQ., & Yuen, MF. (2010). Molecular design of reliable epoxy-copper interface using Molecular Dynamic Simulation. In Ernst, LJ, Driel, WD van, Zhang, GQ, Rodgers, P, Bailey, C, & Saint Leger, O de (Eds.), Proceedings of 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, Bordeaux, France, April 26-27-28-2010 (pp. 1-7). IEEE Society.