This chapter aims at developing molecular modeling methodology to select a thiol-based self assembly monolayer (SAM) as a coupling agent for achieving a reliable epoxy-copper interfacial adhesion under moisture conditions. Moisture diffusion and interfacial energy is evaluated using molecular dynamics simulations. The qualitative agreement of the calculated interfacial energy with the experimental adhesion energy demonstrates that the molecular dynamics method is an effective way in selecting the coupling agent candidates.
|Title of host publication||Molecular Modeling and Multiscaling Issues for Electronic Material Applications|
|Editors||N Iwamoto, MMF Yuen, H Fan|
|Number of pages||292|
|Publication status||Published - 2011|
- authored books
- Boekdeel internat.wet