Molecular dynamics study of the traction-displacement relations of epoxy-copper interfaces

CKY Wong, SYY Leung, RH Poelma, KMB Jansen, CA Yuan, WD van Driel, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)
Original languageEnglish
Title of host publication12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011)
EditorsLJ Ernst, GQ Zhang, WD van Driel, P Rodgers, C Bailey, O de Saint Leger
Place of PublicationPiscataway
PublisherIEEE Society
Pages1-5
Number of pages5
ISBN (Print)978-1-4577-0106-1
DOIs
Publication statusPublished - 2011
EventEuroSimE 2011: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Linz, Austria
Duration: 18 Apr 201120 Apr 2011
Conference number: 12

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2011
CountryAustria
CityLinz
Period18/04/1120/04/11

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

Cite this

Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD., & Zhang, GQ. (2011). Molecular dynamics study of the traction-displacement relations of epoxy-copper interfaces. In LJ. Ernst, GQ. Zhang, WD. V. Driel, P. Rodgers, C. Bailey, & O. D. Saint Leger (Eds.), 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011) (pp. 1-5). IEEE Society. https://doi.org/10.1109/ESIME.2011.5765785