Molecular Dynamics Study on the Sintering Behavior and Mechanical Properties of Graphene-Doped Nano-Copper

Yihong  Zhu; Lingen Wang; Yuqi  Wang; Shizhen Li; Qihang Zong; Chenshan Gao; Xu Liu; Huaiyu Ye

doi:10.1109/ICEPT67137.2025.11157055

Molecular Dynamics Study on the Sintering Behavior and Mechanical Properties of Graphene-Doped Nano-Copper

Yihong Zhu, Lingen Wang, Yuqi Wang, Shizhen Li, Qihang Zong, Chenshan Gao, Xu Liu, Huaiyu Ye

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Abstract

Graphene is widely used to reinforce metal matrix composites due to its excellent physical and mechanical properties. However, its poor interfacial wettability and dispersion problems in copper-based brazing filler metals still limit its application effect.This study explored the influence of graphene on the sintering behavior and structural properties of copper nanoparticles under different doping conditions through molecular dynamics simulation combined with experimental methods. The results show that an appropriate amount of well-dispersed graphene helps promote the densification process and improve the structural stability, while graphene in the agglomerated state may have an adverse effect on the mechanical properties. This work provides theoretical support and experimental basis for optimizing the application of graphene in copper-based brazing metals.

Original language	English
Title of host publication	Proceedings of the 2025 26th International Conference on Electronic Packaging Technology (ICEPT)
Publisher	IEEE
Number of pages	6
Edition	2025
ISBN (Electronic)	978-1-6654-6580-9
ISBN (Print)	978-1-6654-7736-9
DOIs	https://doi.org/10.1109/ICEPT67137.2025.11157055
Publication status	Published - 2025
Event	2025 26th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China Duration: 5 Aug 2025 → 7 Aug 2025 Conference number: 26th

Conference

Conference	2025 26th International Conference on Electronic Packaging Technology (ICEPT)
Country/Territory	China
City	Shanghai
Period	5/08/25 → 7/08/25

Bibliographical note

Green Open Access added to TU Delft Institutional Repository as part of the Taverne amendment. More information about this copyright law amendment can be found at https://www.openaccess.nl. Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

Potential energy
Graphene
Sintering
Conductivity
Mechanical factors
Brazing
Structural engineering
Copper
Polymers
Dispersion
Cu paste
sintering
graphene
molecular dynamics

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10.1109/ICEPT67137.2025.11157055

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title = "Molecular Dynamics Study on the Sintering Behavior and Mechanical Properties of Graphene-Doped Nano-Copper",

abstract = "Graphene is widely used to reinforce metal matrix composites due to its excellent physical and mechanical properties. However, its poor interfacial wettability and dispersion problems in copper-based brazing filler metals still limit its application effect.This study explored the influence of graphene on the sintering behavior and structural properties of copper nanoparticles under different doping conditions through molecular dynamics simulation combined with experimental methods. The results show that an appropriate amount of well-dispersed graphene helps promote the densification process and improve the structural stability, while graphene in the agglomerated state may have an adverse effect on the mechanical properties. This work provides theoretical support and experimental basis for optimizing the application of graphene in copper-based brazing metals.",

keywords = "Potential energy, Graphene, Sintering, Conductivity, Mechanical factors, Brazing, Structural engineering, Copper, Polymers, Dispersion, Cu paste, sintering, graphene, molecular dynamics",

author = "Yihong Zhu and Lingen Wang and Yuqi Wang and Shizhen Li and Qihang Zong and Chenshan Gao and Xu Liu and Huaiyu Ye",

note = "Green Open Access added to TU Delft Institutional Repository as part of the Taverne amendment. More information about this copyright law amendment can be found at https://www.openaccess.nl. Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.; 2025 26th International Conference on Electronic Packaging Technology (ICEPT) ; Conference date: 05-08-2025 Through 07-08-2025",

year = "2025",

doi = "10.1109/ICEPT67137.2025.11157055",

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publisher = "IEEE",

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edition = "2025",

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Zhu, Y, Wang, L, Wang, Y, Li, S, Zong, Q, Gao, C, Liu, X & Ye, H 2025, Molecular Dynamics Study on the Sintering Behavior and Mechanical Properties of Graphene-Doped Nano-Copper. in Proceedings of the 2025 26th International Conference on Electronic Packaging Technology (ICEPT). 2025 edn, IEEE, 2025 26th International Conference on Electronic Packaging Technology (ICEPT), Shanghai, China, 5/08/25. https://doi.org/10.1109/ICEPT67137.2025.11157055

Molecular Dynamics Study on the Sintering Behavior and Mechanical Properties of Graphene-Doped Nano-Copper. / Zhu, Yihong; Wang, Lingen; Wang, Yuqi et al.
Proceedings of the 2025 26th International Conference on Electronic Packaging Technology (ICEPT). 2025. ed. IEEE, 2025.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Molecular Dynamics Study on the Sintering Behavior and Mechanical Properties of Graphene-Doped Nano-Copper

AU - Zhu, Yihong

AU - Wang, Lingen

AU - Wang, Yuqi

AU - Li, Shizhen

AU - Zong, Qihang

AU - Gao, Chenshan

AU - Liu, Xu

AU - Ye, Huaiyu

N1 - Conference code: 26th

PY - 2025

Y1 - 2025

N2 - Graphene is widely used to reinforce metal matrix composites due to its excellent physical and mechanical properties. However, its poor interfacial wettability and dispersion problems in copper-based brazing filler metals still limit its application effect.This study explored the influence of graphene on the sintering behavior and structural properties of copper nanoparticles under different doping conditions through molecular dynamics simulation combined with experimental methods. The results show that an appropriate amount of well-dispersed graphene helps promote the densification process and improve the structural stability, while graphene in the agglomerated state may have an adverse effect on the mechanical properties. This work provides theoretical support and experimental basis for optimizing the application of graphene in copper-based brazing metals.

AB - Graphene is widely used to reinforce metal matrix composites due to its excellent physical and mechanical properties. However, its poor interfacial wettability and dispersion problems in copper-based brazing filler metals still limit its application effect.This study explored the influence of graphene on the sintering behavior and structural properties of copper nanoparticles under different doping conditions through molecular dynamics simulation combined with experimental methods. The results show that an appropriate amount of well-dispersed graphene helps promote the densification process and improve the structural stability, while graphene in the agglomerated state may have an adverse effect on the mechanical properties. This work provides theoretical support and experimental basis for optimizing the application of graphene in copper-based brazing metals.

KW - Potential energy

KW - Graphene

KW - Sintering

KW - Conductivity

KW - Mechanical factors

KW - Brazing

KW - Structural engineering

KW - Copper

KW - Polymers

KW - Dispersion

KW - Cu paste

KW - sintering

KW - graphene

KW - molecular dynamics

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DO - 10.1109/ICEPT67137.2025.11157055

M3 - Conference contribution

SN - 978-1-6654-7736-9

BT - Proceedings of the 2025 26th International Conference on Electronic Packaging Technology (ICEPT)

PB - IEEE

T2 - 2025 26th International Conference on Electronic Packaging Technology (ICEPT)

Y2 - 5 August 2025 through 7 August 2025

ER -

Molecular Dynamics Study on the Sintering Behavior and Mechanical Properties of Graphene-Doped Nano-Copper

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