Monolithic 3D Integration of SRAM and image sensor using two layers of single grain silicon

N Golshani, J Derakhshandeh, R Ishihara, CIM Beenakker, M Robertson, T Morrison

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

13 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings 2nd International 3D Integration Conference
EditorsP Ramm et al
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages1-4
Number of pages4
Publication statusPublished - 2010
EventIEEE International 3D Integration Conference, Munich, Germany - Piscataway, NJ, USA
Duration: 16 Nov 201018 Nov 2010

Publication series

Name
PublisherIEEE

Conference

ConferenceIEEE International 3D Integration Conference, Munich, Germany
Period16/11/1018/11/10

Keywords

  • Conf.proc. > 3 pag

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