Monolithic 3D Integration of SRAM and image sensor using two layers of single grain silicon

N Golshani; J Derakhshandeh; R Ishihara; CIM Beenakker; M Robertson; T Morrison

Monolithic 3D Integration of SRAM and image sensor using two layers of single grain silicon

N Golshani, J Derakhshandeh, R Ishihara, CIM Beenakker, M Robertson, T Morrison

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

13 Citations (Scopus)

Original language	English
Title of host publication	Proceedings 2nd International 3D Integration Conference
Editors	P Ramm et al
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE
Pages	1-4
Number of pages	4
Publication status	Published - 2010
Event	IEEE International 3D Integration Conference, Munich, Germany - Piscataway, NJ, USA Duration: 16 Nov 2010 → 18 Nov 2010

Publication series

Name
Publisher	IEEE

Conference

Conference	IEEE International 3D Integration Conference, Munich, Germany
Period	16/11/10 → 18/11/10

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{3820cb2366754e3f979850bcc9fb101c,

title = "Monolithic 3D Integration of SRAM and image sensor using two layers of single grain silicon",

keywords = "Conf.proc. > 3 pag",

author = "N Golshani and J Derakhshandeh and R Ishihara and CIM Beenakker and M Robertson and T Morrison",

year = "2010",

language = "English",

publisher = "IEEE",

pages = "1--4",

editor = "{Ramm et al}, P",

booktitle = "Proceedings 2nd International 3D Integration Conference",

address = "United States",

note = "IEEE International 3D Integration Conference, Munich, Germany ; Conference date: 16-11-2010 Through 18-11-2010",

}

Golshani, N, Derakhshandeh, J, Ishihara, R , Beenakker, CIM, Robertson, M & Morrison, T 2010, Monolithic 3D Integration of SRAM and image sensor using two layers of single grain silicon. in P Ramm et al (ed.), Proceedings 2nd International 3D Integration Conference. IEEE, Piscataway, NJ, USA, pp. 1-4, IEEE International 3D Integration Conference, Munich, Germany, 16/11/10.

Monolithic 3D Integration of SRAM and image sensor using two layers of single grain silicon. / Golshani, N; Derakhshandeh, J; Ishihara, R et al.
Proceedings 2nd International 3D Integration Conference. ed. / P Ramm et al. Piscataway, NJ, USA: IEEE, 2010. p. 1-4.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Monolithic 3D Integration of SRAM and image sensor using two layers of single grain silicon

AU - Golshani, N

AU - Derakhshandeh, J

AU - Ishihara, R

AU - Beenakker, CIM

AU - Robertson, M

AU - Morrison, T

PY - 2010

Y1 - 2010

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 1

EP - 4

BT - Proceedings 2nd International 3D Integration Conference

A2 - Ramm et al, P

PB - IEEE

CY - Piscataway, NJ, USA

T2 - IEEE International 3D Integration Conference, Munich, Germany

Y2 - 16 November 2010 through 18 November 2010

ER -