Monolithic 3D Wafer Level Integration: Applied for Smart LED Wafer Level Packaging

Zahra Kolahdouz Esfahani

Research output: ThesisDissertation (TU Delft)

202 Downloads (Pure)
Original languageEnglish
Supervisors/Advisors
  • Zhang, G.Q., Supervisor
  • van Zeijl, H.W., Advisor
Award date19 Jan 2017
Print ISBNs978-94-028-0513-0
DOIs
Publication statusPublished - 2017

Keywords

  • System-in-Package
  • 3D wafer-level integration
  • LED
  • high aspect ratio lithography
  • multi-step imaging
  • smart silicon interposer
  • side-wall photodiode
  • blue/UV selective photodetector
  • sensor readout
  • BiCMOS process
  • wafer-level optic
  • multidisciplinary simulation
  • optical simulation

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