@phdthesis{ca460c12bf404f409240d6c8aa5c37ca,
title = "Monolithic 3D Wafer Level Integration: Applied for Smart LED Wafer Level Packaging",
keywords = "System-in-Package, 3D wafer-level integration, LED, high aspect ratio lithography, multi-step imaging, smart silicon interposer, side-wall photodiode, blue/UV selective photodetector, sensor readout, BiCMOS process, wafer-level optic, multidisciplinary simulation, optical simulation",
author = "{Kolahdouz Esfahani}, Zahra",
year = "2017",
doi = "10.4233/uuid:ca460c12-bf40-4f40-9240-d6c8aa5c37ca",
language = "English",
isbn = "978-94-028-0513-0",
school = "Delft University of Technology",
}