Multi-LED package design, fabrication and thermal analysis

RH Poelma, S Tarashioon, HW van Zeijl, S Goldbach, JLJ Zijl, GQ Zhang

Research output: Contribution to journal › Article › Scientific › peer-review

6 Citations (Scopus)

Harvest

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@article{ff4e5b6c6d844b988773a1c462c78935,

title = "Multi-LED package design, fabrication and thermal analysis",

author = "RH Poelma and S Tarashioon and {van Zeijl}, HW and S Goldbach and JLJ Zijl and GQ Zhang",

note = "Harvest",

year = "2013",

doi = "10.1088/1674-4926/34/5/054002",

language = "English",

volume = "34",

pages = "1--5",

journal = "Journal of Semiconductors",

issn = "1674-4926",

publisher = "IOS Press",

number = "5",

}

TY - JOUR

T1 - Multi-LED package design, fabrication and thermal analysis

AU - Poelma, RH

AU - Tarashioon, S

AU - van Zeijl, HW

AU - Goldbach, S

AU - Zijl, JLJ

AU - Zhang, GQ

N1 - Harvest

PY - 2013

Y1 - 2013

U2 - 10.1088/1674-4926/34/5/054002

DO - 10.1088/1674-4926/34/5/054002

M3 - Article

VL - 34

SP - 1

EP - 5

JO - Journal of Semiconductors

JF - Journal of Semiconductors

SN - 1674-4926

IS - 5

ER -