Multi-parameters optimization for electromigration in WLCSP solder bumps

Leiming Du*, Shanliang Deng, Zhen Cui, René Poelma, Caroline Beelen-Hendrikx, Kouchi Zhang

*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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Abstract

In this study, we combined finite element method (FEM) based on Ansys and Noesis Optimus software to investigate the effect of bump structures and loading conditions on the electromigration properties of solder bumps in WLCSP. A numerical model considering current density, vacancy concentration, stress and temperature was utilized to calculate the vacancy concentration in solder bumps. The Optimus is an optimization software which can be used to perform the design of experiment (DOE) and sensitivity analysis. To optimize the bump structure, the DOE and response surface modeling (RSM) analysis were performed by using Noesis Optimus. The design optimization based on Noesis Optimus has three main advantages. First, the sensitivity analysis based on DOE results helps to find the most contributing factors. Second, it saves huge time because hundreds of experiments can be executed automatically. Third, it is able to perform evolutionary design optimization directly on RSM to identify the design’s optimal performance point. The maximum and concentration around solder were selected as the index to evaluate the effect of parameter combination on electromigration properties.
Original languageEnglish
Title of host publicationProceedings of the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
PublisherIEEE
Number of pages4
ISBN (Electronic)979-8-3503-9363-7
ISBN (Print)979-8-3503-9364-4
DOIs
Publication statusPublished - 2024
Event2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Catania, Italy
Duration: 7 Apr 202410 Apr 2024
Conference number: 25th

Publication series

Name2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024

Conference

Conference2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Abbreviated titleEuriSimE 2024
Country/TerritoryItaly
CityCatania
Period7/04/2410/04/24

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

  • Temperature sensors
  • Electromigration
  • Temperature
  • Sensitivity analysis
  • Loading
  • Software
  • Numerical models

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