Abstract
This dissertation presents a comprehensive and integrated study, including theory development, numerical simulation and experiment, for multi-physics driven electromigration in microelectronics. Multi-scale methodologies from atomistic modeling to continuum theory-based simulation have been developed. Moreover, extensive experimental testing, from testing wafer/die design and fabrication, sample preparation and process, to the measurement setup and characterization, has been conducted. The dissertation also provides synergetic and cohesive analysis between simulation and experiment. The simulation predictions and results have been well validated by experimental data.
| Original language | English |
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| Qualification | Doctor of Philosophy |
| Awarding Institution |
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| Supervisors/Advisors |
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| Award date | 20 Dec 2021 |
| DOIs | |
| Publication status | Published - 2021 |
Keywords
- Electromigration Simulation
- Multiphysics
- Multiscale, Accelerated Measurement
- Stress-Migration
- Self-Diffusion
- Thermomigration
- Molecular Dynamic Simulation
- Finite Element Simulation