Multiprobe resistance monitoring of Blech pattern during electromigration testing.

S Shingubara, T Osaka, H Sakaue, T Takahagi, AH Verbruggen

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proceedings Stress Induced Phenomena in Metallization.
Editors	O Kraft
Publisher	American Institute of Physics
Pages	138-149
Number of pages	12
ISBN (Print)	1-56396-904-1
Publication status	Published - 1999

Name
Publisher	American Institute of Physics

Name
Volume	1

Cite this

@inproceedings{ef177956a2384930a24c92100fb88e41,

title = "Multiprobe resistance monitoring of Blech pattern during electromigration testing.",

author = "S Shingubara and T Osaka and H Sakaue and T Takahagi and AH Verbruggen",

year = "1999",

language = "Undefined/Unknown",

isbn = "1-56396-904-1",

publisher = "American Institute of Physics",

pages = "138--149",

editor = "O Kraft",

booktitle = "Proceedings Stress Induced Phenomena in Metallization.",

address = "United States",

}

TY - GEN

T1 - Multiprobe resistance monitoring of Blech pattern during electromigration testing.

AU - Shingubara, S

AU - Osaka, T

AU - Sakaue, H

AU - Takahagi, T

AU - Verbruggen, AH

PY - 1999

Y1 - 1999

M3 - Conference contribution

SN - 1-56396-904-1

SP - 138

EP - 149

BT - Proceedings Stress Induced Phenomena in Metallization.

A2 - Kraft, O

PB - American Institute of Physics

ER -