Nanoindentation characterization of sintered porous Cu nanoparticles used in power electronics packaging – A molecular dynamic simulation study

Dong Hu, Zichuan Li, Jiajie Fan, Guoqi Zhang*

*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for design for reliability. Both sintering and subsequent nanoindentation were studied by simulation. The effect of porosity on the nanoindentation response was investigated by setting different initial packing densities. In addition, the impact of indenter size and indentation positions on the nanoindentation response were discussed. The nanoindentation behaviors were studied by extracting loading-displacement (P-h) curves and calculating elastic modulus and hardness. In addition, the microstructure evolution was adopted using atomic configuration to study the nanoindentation mechanism. This work offers valuable insights into the Cu sinter paste preparation phase for sintering technology.
Original languageEnglish
Title of host publicationProceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023
EditorsAndrew Tay, King Jien Chui, Yeow Kheng Lim, Chuan Seng Tan, Sunmi Shin
PublisherIEEE
Pages727-733
Number of pages7
ISBN (Electronic)979-8-3503-2957-5
ISBN (Print)979-8-3503-2958-2
DOIs
Publication statusPublished - 2023
Event2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore
Duration: 5 Dec 20238 Dec 2023
Conference number: 25

Publication series

NameProceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023

Conference

Conference2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
Country/TerritorySingapore
CitySingapore
Period5/12/238/12/23

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

  • Nanoindentation
  • Sintering technology
  • Cu nanoparticles
  • molecular dynamics

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