New fabrication technology for wafer-through hole interconnects

VG Kiutchoukov; E Boellaard; JR Mollinger; A Bossche

New fabrication technology for wafer-through hole interconnects

VG Kiutchoukov, E Boellaard, JR Mollinger, A Bossche

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	SAFE - ProRISC - SeSens: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology
Place of Publication	Utrecht
Publisher	STW Technology Foundation
Pages	813-817
Number of pages	5
ISBN (Print)	90-73461-29-4
Publication status	Published - 2001
Event	SAFE ProRISC SeSens 2001, Veldhoven - Utrecht Duration: 28 Nov 2001 → 30 Nov 2001

Publication series

Name
Publisher	STW technology foundation

Conference

Conference	SAFE ProRISC SeSens 2001, Veldhoven
Period	28/11/01 → 30/11/01

Keywords

ZX Int.klas.verslagjaar < 2002

Cite this

Kiutchoukov, VG., Boellaard, E., Mollinger, JR., & Bossche, A. (2001). New fabrication technology for wafer-through hole interconnects. In SAFE - ProRISC - SeSens: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology (pp. 813-817). STW Technology Foundation.

@inproceedings{ada22a5f9c55485f8d261b240b104213,

title = "New fabrication technology for wafer-through hole interconnects",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "VG Kiutchoukov and E Boellaard and JR Mollinger and A Bossche",

year = "2001",

language = "Undefined/Unknown",

isbn = "90-73461-29-4",

publisher = "STW Technology Foundation",

pages = "813--817",

booktitle = "SAFE - ProRISC - SeSens: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology",

note = "SAFE ProRISC SeSens 2001, Veldhoven ; Conference date: 28-11-2001 Through 30-11-2001",

}

Kiutchoukov, VG, Boellaard, E, Mollinger, JR & Bossche, A 2001, New fabrication technology for wafer-through hole interconnects. in SAFE - ProRISC - SeSens: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology. STW Technology Foundation, Utrecht, pp. 813-817, SAFE ProRISC SeSens 2001, Veldhoven, 28/11/01.

New fabrication technology for wafer-through hole interconnects. / Kiutchoukov, VG; Boellaard, E; Mollinger, JR et al.
SAFE - ProRISC - SeSens: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology. Utrecht: STW Technology Foundation, 2001. p. 813-817.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - New fabrication technology for wafer-through hole interconnects

AU - Kiutchoukov, VG

AU - Boellaard, E

AU - Mollinger, JR

AU - Bossche, A

PY - 2001

Y1 - 2001

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 90-73461-29-4

SP - 813

EP - 817

BT - SAFE - ProRISC - SeSens: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology

PB - STW Technology Foundation

CY - Utrecht

T2 - SAFE ProRISC SeSens 2001, Veldhoven

Y2 - 28 November 2001 through 30 November 2001

ER -